Invention Grant
- Patent Title: Dopant activation in doped semiconductor substrates
- Patent Title (中): 掺杂半导体衬底中的掺杂剂活化
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Application No.: US11844810Application Date: 2007-08-24
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Publication No.: US07989366B2Publication Date: 2011-08-02
- Inventor: Jeffrey C. Munro , Srinivas D. Nemani , Young S. Lee , Marlon Menezes , Christopher Dennis Bencher , Vijay Parihar
- Applicant: Jeffrey C. Munro , Srinivas D. Nemani , Young S. Lee , Marlon Menezes , Christopher Dennis Bencher , Vijay Parihar
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
Methods are disclosed for activating dopants in a doped semiconductor substrate. A carbon precursor is flowed into a substrate processing chamber within which the doped semiconductor substrate is disposed. A plasma is formed from the carbon precursor in the substrate processing chamber. A carbon film is deposited over the substrate with the plasma. A temperature of the substrate is maintained while depositing the carbon film less than 500° C. The deposited carbon film is exposed to electromagnetic radiation for a period less than 10 ms, and has an extinction coefficient greater than 0.3 at a wavelength comprised by the electromagnetic radiation.
Public/Granted literature
- US20080057740A1 DOPANT ACTIVATION IN DOPED SEMICONDUCTOR SUBSTRATES Public/Granted day:2008-03-06
Information query
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