发明授权
- 专利标题： Carbon nanotube circuit component structure
- 专利标题（中）： 碳纳米管电路元件结构
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申请号： US11563215申请日： 2006-11-27
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公开(公告)号： US07990037B2公开(公告)日： 2011-08-02
- 发明人: Mou-Shiung Lin , Chien-Kang Chou , Hsin-Jung Lo
- 申请人： Mou-Shiung Lin , Chien-Kang Chou , Hsin-Jung Lo
- 申请人地址： TW Hsinchu
- 专利权人： Megica Corporation
- 当前专利权人： Megica Corporation
- 当前专利权人地址： TW Hsinchu
- 代理机构： McDermott Will & Emery, LLP
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
The present invention proposes a circuit component structure, which comprises a semiconductor substrate, a fine-line metallization structure formed over the semiconductor substrate and having at least one metal pad, a passivation layer formed over the fine-line metallization structure with the metal pads exposed by the openings of the passivation layer, at least one carbon nanotube layer formed over the fine-line metallization structure and the passivation layer and connecting with the metal pads. The present invention is to provide a carbon nanotube circuit component structure and a method for fabricating the same, wherein the circuit of a semiconductor element is made of an electrically conductive carbon nanotube, and the circuit of the semiconductor element can thus be made finer and denser via the superior electric conductivity, flexibility and strength of the carbon nanotube.
公开/授权文献
- US20070164430A1 CARBON NANOTUBE CIRCUIT COMPONENT STRUCTURE 公开/授权日：2007-07-19