Invention Grant
- Patent Title: Thermal interface material and method for fabricating the same
- Patent Title (中): 热界面材料及其制造方法
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Application No.: US11959144Application Date: 2007-12-18
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Publication No.: US07993750B2Publication Date: 2011-08-09
- Inventor: Ding Wang , Chang-Hong Liu , Peng-Cheng Song , Shou-Shan Fan
- Applicant: Ding Wang , Chang-Hong Liu , Peng-Cheng Song , Shou-Shan Fan
- Applicant Address: CN Beijing TW Tu-Cheng, New Taipei
- Assignee: Tsinghua University,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Tsinghua University,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Beijing TW Tu-Cheng, New Taipei
- Agent Jeffrey T. Knapp
- Priority: CN200710073770 20070330
- Main IPC: B32B9/00
- IPC: B32B9/00

Abstract:
A thermal interface material includes an array of carbon nanotubes with interspaces defined therebetween; and a low melting point metallic material filled in the interspaces. A method for fabricating a thermal interface material, the method includes (a) providing an array of carbon nanotubes with interspaces defined therebetween; and (b) depositing a low melting point metallic material on the carbon nanotubes in the interspaces therebetween to form a metallic layer with the array of carbon nanotubes embedded therein, and thereby, achieving the thermal interface material.
Public/Granted literature
- US20080241545A1 THERMAL INTERFACE MATERIAL AND METHOD FOR FABRICATING THE SAME Public/Granted day:2008-10-02
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