公开(公告)号：US09275924B2

公开(公告)日：2016-03-01

申请号：US13585500

申请日：2012-08-14

Applicant: Tsung-Ding Wang ,  Jung Wei Cheng ,  Bo-I Lee

Inventor： Tsung-Ding Wang ,  Jung Wei Cheng ,  Bo-I Lee

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/31 ,  H01L23/00 ,  H01L21/00

CPC classification number: H01L23/3185 ,  H01L21/302 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3178 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/94 ,  H01L2221/6834 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/0558 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05686 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11849 ,  H01L2224/1191 ,  H01L2224/13005 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/94 ,  H01L2924/10156 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/206 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/01047

Abstract: A semiconductor package includes a passivation layer overlying a semiconductor substrate, a bump overlying the passivation layer, and a molding compound layer overlying the passivation layer and covering a lower portion of the bump. A sidewall of the passivation layer is covered by the molding compound layer.

Abstract translation: 半导体封装包括覆盖半导体衬底的钝化层，覆盖钝化层的凸块以及覆盖钝化层并覆盖凸块下部的模塑复合层。 钝化层的侧壁被模塑料层覆盖。

公开(公告)号：US08987605B2

公开(公告)日：2015-03-24

申请号：US13247529

申请日：2011-09-28

Applicant: Tsung-Ding Wang ,  Hung-Jen Lin ,  Chien-Hsiun Lee

Inventor： Tsung-Ding Wang ,  Hung-Jen Lin ,  Chien-Hsiun Lee

IPC: H05K1/09 ,  B23K31/02 ,  B23K1/20 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29

CPC classification number: H01L24/11 ,  H01L21/561 ,  H01L21/563 ,  H01L23/293 ,  H01L23/3192 ,  H01L24/13 ,  H01L24/16 ,  H01L24/18 ,  H01L24/81 ,  H01L2224/02379 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05647 ,  H01L2224/10126 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/11515 ,  H01L2224/11849 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/81024 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2224/81 ,  H01L2224/05552 ,  H01L2224/64

Abstract: A device includes a substrate, a metal pad over the substrate, and a passivation layer having a portion over the metal pad. A post-passivation interconnect (PPI) is electrically coupled to the metal pad, wherein the PPI includes a portion over the metal pad and the passivation layer. A polymer layer is over the PPI. A solder ball is over the PPI. A compound includes a portion adjoining the solder ball and the polymer layer, wherein the compound includes flux and a polymer.

Abstract translation: 一种器件包括衬底，衬底上的金属焊盘以及具有在金属焊盘上的部分的钝化层。 后钝化互连（PPI）电耦合到金属焊盘，其中PPI包括在金属焊盘和钝化层上的部分。 聚合物层在PPI之上。 焊球在PPI之上。 化合物包括邻接焊球和聚合物层的部分，其中所述化合物包括助熔剂和聚合物。

公开(公告)号：US08695586B2

公开(公告)日：2014-04-15

申请号：US12381551

申请日：2009-03-12

Applicant: Peng Liu ,  Pi-Jin Chen ,  Liang Liu ,  Kai-Li Jiang ,  Ding Wang ,  Chang-Hong Liu ,  Shou-Shan Fan

Inventor： Peng Liu ,  Pi-Jin Chen ,  Liang Liu ,  Kai-Li Jiang ,  Ding Wang ,  Chang-Hong Liu ,  Shou-Shan Fan

IPC: F24J2/24

CPC classification number: F24S80/50 ,  F24S70/20 ,  F24S70/30 ,  F24S2025/011 ,  Y02E10/40

Abstract: A solar collector includes a substrate having a top surface and a bottom surface opposite to the upper surface, a sidewall, a transparent cover, and a heat-absorbing layer. The sidewall is arranged on the top surface of the substrate. The transparent cover is disposed on the sidewall opposite to the substrate to form a sealed chamber with the substrate together. The heat-absorbing layer is disposed on the upper surface of the substrate and includes a carbon nanotube film having a plurality of carbon nanotubes. The carbon nanotubes in the carbon nanotube film are entangled with each other.

Abstract translation: 太阳能收集器包括具有与上表面相对的顶表面和底表面的基板，侧壁，透明盖和吸热层。 侧壁设置在基板的顶表面上。 透明盖设置在与衬底相对的侧壁上，以形成密封室，衬底在一起。 吸热层设置在基板的上表面上，并且包括具有多个碳纳米管的碳纳米管膜。 碳纳米管膜中的碳纳米管彼此缠结。

公开(公告)号：US08691629B2

公开(公告)日：2014-04-08

申请号：US13117901

申请日：2011-05-27

Applicant: Chi-Ming Huang ,  Tsung-Ding Wang

Inventor： Chi-Ming Huang ,  Tsung-Ding Wang

IPC: H01L21/00 ,  H01L23/00

CPC classification number: H01L24/11 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/67126 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/81815 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: An embodiment is a method for semiconductor packaging. The method comprises attaching a chip to a carrier substrate through a first side of a jig, the chip being attached by bumps; applying balls to bond pads on the carrier substrate through a second side of the jig; and simultaneously reflowing the bumps and the balls. According to a further embodiment, a packaging jig comprises a cover, a base, and a connector. The cover has a first window through the cover. The base has a second window through the base. The first window exposes a first surface of a volume intermediate the cover and the base, and the second window exposes a second surface of the volume. The first surface is opposite the volume from the second surface. The connector aligns and couples the cover to the base.

Abstract translation: 实施例是半导体封装的方法。 该方法包括通过夹具的第一侧将芯片附接到载体衬底，芯片通过凸块附着; 施加球以通过夹具的第二侧将载体基底上的焊盘接合; 同时回流凸块和球。 根据另一实施例，包装夹具包括盖，基座和连接器。 盖子有通过盖子的第一个窗口。 基地有通过基地的第二个窗口。 第一窗口暴露出覆盖物和基底之间的体积的第一表面，并且第二窗口暴露出体积的第二表面。 第一表面与第二表面的体积相反。 连接器将盖子对准并连接到底座。

公开(公告)号：US20130270705A1

公开(公告)日：2013-10-17

申请号：US13444649

申请日：2012-04-11

Applicant: Tsung-Ding Wang ,  Hung-Jen Lin ,  Jiun Yi Wu ,  Mirng-Ji Lii ,  Chien-Hsun Lee

Inventor： Tsung-Ding Wang ,  Hung-Jen Lin ,  Jiun Yi Wu ,  Mirng-Ji Lii ,  Chien-Hsun Lee

IPC: H01L23/48 ,  H01L21/56

CPC classification number: H01L23/4824 ,  H01L21/563 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/528 ,  H01L24/05 ,  H01L24/09 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16056 ,  H01L2224/16146 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Semiconductor devices packages and methods are disclosed. In one embodiment, a package for a semiconductor device includes a substrate and a contact pad disposed on a first surface of the substrate. The contact pad has a first side and a second side opposite the first side. A conductive trace is coupled to the first side of the contact pad, and an extension of the conductive trace is coupled to the second side of the contact pad. A plurality of bond pads is disposed on a second surface of the substrate.

Abstract translation: 公开了半导体器件封装和方法。 在一个实施例中，用于半导体器件的封装包括衬底和设置在衬底的第一表面上的接触焊盘。 接触垫具有与第一侧相对的第一侧和第二侧。 导电迹线耦合到接触焊盘的第一侧，并且导电迹线的延伸部耦合到接触焊盘的第二侧。 多个接合焊盘设置在衬底的第二表面上。

公开(公告)号：US20130162202A1

公开(公告)日：2013-06-27

申请号：US13401463

申请日：2012-02-21

Applicant: Jong-Ding Wang

Inventor： Jong-Ding Wang

IPC: H02J7/00

CPC classification number: H02J50/90 ,  G06F3/044 ,  H02J5/005 ,  H02J7/025 ,  H02J17/00 ,  H02J50/10

Abstract: A wireless charger includes a charging platform and a capacitive touch device. The capacitive touch device includes a first touch-sensitive layer, a second touch-sensitive layer, and a microcontroller. The capacitive touch device is disposed over the charging platform for sensing a position of the electronic device.

Abstract translation: 无线充电器包括充电平台和电容式触摸装置。 电容式触摸装置包括第一触敏层，第二触敏层和微控制器。 电容式触摸装置设置在充电平台上，用于感测电子装置的位置。

公开(公告)号：US20130093084A1

公开(公告)日：2013-04-18

申请号：US13272009

申请日：2011-10-12

Applicant: Hsien-Wei Chen ,  Tsung-Ding Wang ,  Chien-Hsiun Lee ,  Hao-Yi Tsai ,  Mirng-Ji Lii ,  Chen-Hua Yu

Inventor： Hsien-Wei Chen ,  Tsung-Ding Wang ,  Chien-Hsiun Lee ,  Hao-Yi Tsai ,  Mirng-Ji Lii ,  Chen-Hua Yu

IPC: H01L23/498

CPC classification number: H01L24/32 ,  H01L21/563 ,  H01L23/525 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/73 ,  H01L24/98 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/10156 ,  H01L2224/131 ,  H01L2224/14131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29011 ,  H01L2224/32052 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83104 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A package includes a printed circuit board (PCB), and a die bonded to the PCB through solder balls. A re-workable underfill is dispensed in a region between the PCB and the die.

Abstract translation: 封装包括印刷电路板（PCB），以及通过焊球与PCB结合的芯片。 在PCB和模具之间的区域中分配可重新加工的底部填充物。

公开(公告)号：US08411449B2

公开(公告)日：2013-04-02

申请号：US12954539

申请日：2010-11-24

Applicant: Kuo-Hsiang Ouyang ,  Hone-Wei Tang ,  Chung-Ding Wang

Inventor： Kuo-Hsiang Ouyang ,  Hone-Wei Tang ,  Chung-Ding Wang

IPC: H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H05K5/00 ,  H01H9/00

CPC classification number: H03K17/962 ,  H03K2217/960755 ,  H04M1/0277 ,  H04M1/236 ,  H04M2250/22

Abstract: An electronic device includes a housing, a capacitive touch button, a PCB and a connection mechanism. The capacitive touch button is secured in the housing and includes a number of button bodies. The PCB is secured in the housing. The connection mechanism includes a circuit board and a connection element. The circuit board is secured in the housing and includes a number of sensor electrodes and a number of electrical protrusions, which are all arranged corresponding to the number of button bodies of the capacitive touch button. The sensor electrodes are connected to the capacitive touch button and the electrical protrusions. The connection element includes a first end and a second end. The first end is fixed on the PCB. The second end resists against the electrical protrusions for electrically connecting the capacitive touch button and the controller of the PCB.

Abstract translation: 电子设备包括壳体，电容触摸按钮，PCB和连接机构。 电容触摸按钮被固定在外壳中，并且包括多个按钮体。 PCB固定在外壳中。 连接机构包括电路板和连接元件。 电路板被固定在壳体中，并且包括多个传感器电极和多个电突起，它们都对应于电容式触摸按钮的按钮体的数量排列。 传感器电极连接到电容式触摸按钮和电气突起。 连接元件包括第一端和第二端。 第一端固定在PCB上。 第二端抵抗用于电连接电容式触摸按钮和PCB的控制器的电突起。

公开(公告)号：US20120168962A1

公开(公告)日：2012-07-05

申请号：US13419078

申请日：2012-03-13

Applicant: Ku-Feng YANG ,  Weng-Jin WU ,  Wen-Chih CHIOU ,  Tsung-Ding WANG

Inventor： Ku-Feng YANG ,  Weng-Jin WU ,  Wen-Chih CHIOU ,  Tsung-Ding WANG

IPC: H01L23/498 ,  H01L23/29

CPC classification number: H01L23/3114 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/16 ,  H01L24/32 ,  H01L24/80 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/80006 ,  H01L2224/80894 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/81005 ,  H01L2224/81801 ,  H01L2224/83005 ,  H01L2224/8385 ,  H01L2224/94 ,  H01L2224/95001 ,  H01L2225/06541 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/83

Abstract: A thin wafer protection device includes a wafer having a plurality of semiconductor chips. The wafer has a first side and an opposite second side. A plurality of dies is over the first side of the wafer, and at least one of the plurality of dies is bonded to at least one of the plurality of semiconductor chips. A wafer carrier is over the second side of the wafer. An encapsulating layer is over the first side of the wafer and the plurality of dies, and the encapsulating layer has a planar top surface. An adhesive tape is over the planar top surface of the encapsulating layer.

Abstract translation: 薄晶片保护装置包括具有多个半导体芯片的晶片。 晶片具有第一侧和相对的第二侧。 多个管芯在晶片的第一侧上方，多个管芯中的至少一个与多个半导体芯片中的至少一个接合。 晶片载体在晶片的第二面之上。 封装层在晶片的第一侧和多个管芯之上，并且封装层具有平坦的顶表面。 粘合带在封装层的平坦顶表面之上。

公开(公告)号：US20120045571A1

公开(公告)日：2012-02-23

申请号：US13201235

申请日：2010-02-01

Applicant: Klaus-W. Lienert ,  Ding Wang ,  Lixin Ye ,  Changshun Zhou ,  Wenxue Guo

Inventor： Klaus-W. Lienert ,  Ding Wang ,  Lixin Ye ,  Changshun Zhou ,  Wenxue Guo

IPC: C09D167/02 ,  B05D5/12

CPC classification number: C08G18/8067 ,  C08G18/42 ,  C09D175/04 ,  C09D175/06 ,  C09D175/12 ,  H01B3/302 ,  H01B3/308 ,  H01B3/423

Abstract: Described is a polyurethane wire enamel composed of at least one blocked polyisocyanate adduct, blocked with alkylphenols, at least one hydroxy polyester comprising ester and/or imide and/or amide groups, at least one hydrocarbon-based organic solvent, and further auxiliaries and additives.

Abstract translation: 描述了由至少一种被烷基酚阻断的至少一种封端的多异氰酸酯加合物，至少一种包含酯和/或酰亚胺和/或酰胺基团的羟基聚酯，至少一种烃类有机溶剂，以及其它助剂和添加剂 。