Invention Grant
- Patent Title: Heating and cooling cup
- Patent Title (中): 加热和冷却杯
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Application No.: US12178701Application Date: 2008-07-24
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Publication No.: US07997786B2Publication Date: 2011-08-16
- Inventor: Pei-Chuan Liu
- Applicant: Pei-Chuan Liu
- Applicant Address: TW Taipei SG Singapore
- Assignee: Pei-Chuan Liu,Teck-Huat Chua
- Current Assignee: Pei-Chuan Liu,Teck-Huat Chua
- Current Assignee Address: TW Taipei SG Singapore
- Agency: Rabin & Berdo, P.C.
- Main IPC: B01F9/10
- IPC: B01F9/10 ; B01F15/06 ; F25B21/02 ; F27D11/00

Abstract:
A heating and cooling cup includes a cup body, a stirring device, a heating and cooling chip, and a heat sink module. A heat conductive block is disposed under the cup body, the heat conductive block abuts against the heating and cooling chip, the stirring device has a stirring rod disposed in the cup body, and a bottom surface of the heating and cooling chip abuts against a heat conductive block of the heat sink module. A temperature of the cup body is changed through the heating and cooling chip, for cooling or heating liquid food in the cup body, and the liquid food is forced to generate convection through the stirring rod for accelerating a temperature variation process.
Public/Granted literature
- US20100018982A1 HEATING AND COOLING CUP Public/Granted day:2010-01-28
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