Invention Grant
- Patent Title: Dicing/die bonding film
- Patent Title (中): 切片/芯片接合薄膜
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Application No.: US12529070Application Date: 2008-01-28
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Publication No.: US07998552B2Publication Date: 2011-08-16
- Inventor: Yasuhiro Amano , Sadahito Misumi , Takeshi Matsumura
- Applicant: Yasuhiro Amano , Sadahito Misumi , Takeshi Matsumura
- Applicant Address: JP Osaka
- Assignee: Nittok Denko Corporation
- Current Assignee: Nittok Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2007-051805 20070301
- International Application: PCT/JP2008/051177 WO 20080128
- International Announcement: WO2008/108119 WO 20080912
- Main IPC: H01L21/301
- IPC: H01L21/301 ; H01L21/52
Abstract:
A dicing die-bonding film in which the adhesive properties during the dicing step and the peeling properties during the pickup step are controlled so that both become good, and a production method thereof, are provided. The dicing die-bonding film in the present invention is a dicing die-bonding film having a pressure-sensitive adhesive layer on a base material and a die bond layer on the pressure-sensitive adhesive layer, in which the arithmetic mean roughness X (μm) on the pressure-sensitive adhesive layer side in the die bond layer is 0.015 μm to 1 μm, the arithmetic mean roughness Y (μm) on the die bond layer side in the pressure-sensitive adhesive layer is 0.03 μm to 1 μm, and the absolute value of the difference of the X and Y is 0.015 or more.
Public/Granted literature
- US20100093154A1 DICING/DIE BONDING FILM Public/Granted day:2010-04-15
Information query
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