发明授权
- 专利标题: Circuit board having isolation cover and assembling method thereof
- 专利标题(中): 具有隔离罩的电路板及其组装方法
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申请号: US12341560申请日: 2008-12-22
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公开(公告)号: US07999195B2公开(公告)日: 2011-08-16
- 发明人: Chung-Shao Huang , Ching-Feng Hsieh , Jen-Huan Yu , Cheng-Wen Dai , Kuo-Ching Chen
- 申请人: Chung-Shao Huang , Ching-Feng Hsieh , Jen-Huan Yu , Cheng-Wen Dai , Kuo-Ching Chen
- 申请人地址: TW Taipei
- 专利权人: Askey Computer Corp.
- 当前专利权人: Askey Computer Corp.
- 当前专利权人地址: TW Taipei
- 代理机构: Rabin & Berdo, P.C.
- 优先权: TW97139173A 20081013
- 主分类号: H05K9/00
- IPC分类号: H05K9/00
摘要:
The present invention provides a circuit board having an isolation cover and an assembling method thereof. The circuit board of the present invention comprises a main body and an isolation cover disposed on the circuit board main body. The main body and the isolation cover have a plurality of corresponding first and second positioning portions, and a ground portion is disposed on at least one side of each first positioning portion. The isolation cover is disposed on a first surface of the main body, and each second positioning portion passes through a second surface of the main body and each first positioning portion. An end of each second positioning portion is connected to each ground portion.
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