公开(公告)号：USD687788S1

公开(公告)日：2013-08-13

申请号：US29425804

申请日：2012-06-27

Applicant: Kuo-Ching Chen ,  Chien-Hsuan Chien

Designer： Kuo-Ching Chen ,  Chien-Hsuan Chien

公开(公告)号：US07999195B2

公开(公告)日：2011-08-16

申请号：US12341560

申请日：2008-12-22

Applicant: Chung-Shao Huang ,  Ching-Feng Hsieh ,  Jen-Huan Yu ,  Cheng-Wen Dai ,  Kuo-Ching Chen

Inventor： Chung-Shao Huang ,  Ching-Feng Hsieh ,  Jen-Huan Yu ,  Cheng-Wen Dai ,  Kuo-Ching Chen

IPC: H05K9/00

CPC classification number: H05K9/0026 ,  Y10T29/49124

Abstract: The present invention provides a circuit board having an isolation cover and an assembling method thereof. The circuit board of the present invention comprises a main body and an isolation cover disposed on the circuit board main body. The main body and the isolation cover have a plurality of corresponding first and second positioning portions, and a ground portion is disposed on at least one side of each first positioning portion. The isolation cover is disposed on a first surface of the main body, and each second positioning portion passes through a second surface of the main body and each first positioning portion. An end of each second positioning portion is connected to each ground portion.

Abstract translation: 本发明提供一种具有隔离罩及其组装方法的电路板。 本发明的电路板包括设置在电路板主体上的主体和隔离盖。 主体和隔离盖具有多个对应的第一和第二定位部分，并且接地部分设置在每个第一定位部分的至少一侧上。 隔离盖设置在主体的第一表面上，并且每个第二定位部分穿过主体的第二表面和每个第一定位部分。 每个第二定位部分的端部连接到每个接地部分。

公开(公告)号：US07958625B2

公开(公告)日：2011-06-14

申请号：US12365969

申请日：2009-02-05

Applicant: Chia-Hung Lee ,  Jen-Huan Yu ,  Chung-Shao Huang ,  Ching-Feng Hsieh ,  Cheng-Wen Dai ,  Kuo-Ching Chen

Inventor： Chia-Hung Lee ,  Jen-Huan Yu ,  Chung-Shao Huang ,  Ching-Feng Hsieh ,  Cheng-Wen Dai ,  Kuo-Ching Chen

IPC: B23P19/00 ,  H05K3/36

CPC classification number: H05K9/0022 ,  H05K13/0447 ,  H05K13/0473 ,  Y10T29/49126 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53252 ,  Y10T29/5327

Abstract: An assembly device includes a base having a supporting portion upon which an isolation cover and a main body are disposed. A press-fitting mechanism is movably connected to the base, and includes a press-fitting portion facing the supporting portion and disposed corresponding in position to the supporting portion, and further portions for guiding and bending second positioning portions. The further portions are movably disposed on external side faces of the press-fitting portion. The press-fitting mechanism also has first portions for holding the further portions to the external side faces of the press-fitting portion, and has second portions passing through upper ends of the further portions. A drive mechanism is disposed at the base and has a drive portion connected to the press-fitting mechanism, for driving the press-fitting mechanism to move towards the supporting portion via the drive portion, so as to bend and fasten ends of second positioning portions.

Abstract translation: 组装装置包括具有支撑部分的基部，隔离盖和主体设置在该支撑部分上。 压入机构可移动地连接到基座，并且包括面向支撑部分并且相对于支撑部分位置设置的压配部分，以及用于引导和弯曲第二定位部分的另外的部分。 另外的部分可移动地设置在压配部分的外侧面上。 压入机构还具有用于将另外的部分保持在压配部的外侧面的第一部分，并且具有穿过其它部分的上端的第二部分。 驱动机构设置在基座上，具有与压配机构连接的驱动部，驱动压配机构经由驱动部向支撑部移动，从而弯曲并固定第二定位部的端部 。

公开(公告)号：US20100095518A1

公开(公告)日：2010-04-22

申请号：US12365969

申请日：2009-02-05

Applicant: Chia-Hung LEE ,  Jen-Huan YU ,  Chung-Shao HUANG ,  Ching-Feng HSIEH ,  Cheng-Wen DAI ,  Kuo-Ching CHEN

Inventor： Chia-Hung LEE ,  Jen-Huan YU ,  Chung-Shao HUANG ,  Ching-Feng HSIEH ,  Cheng-Wen DAI ,  Kuo-Ching CHEN

IPC: B23P19/02 ,  B30B1/04

CPC classification number: H05K9/0022 ,  H05K13/0447 ,  H05K13/0473 ,  Y10T29/49126 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53252 ,  Y10T29/5327

Abstract: An assembly device applicable to assembling an isolation cover to a main body of a circuit board is provided. The main body and the isolation cover respectively have a plurality of first positioning portions and a plurality of second positioning portions corresponding to each other. The second positioning portions correspondingly pass through the first positioning portions, respectively. The assembly device includes a base, a press-fitting mechanism movably connected to the base, and a drive mechanism disposed at the base. The base has a supporting portion for disposing the isolation cover and the main body. The press-fitting mechanism has a press-fitting portion facing the supporting portion. The drive mechanism has a drive portion connected to the press-fitting mechanism, for driving the press-fitting mechanism to move towards the supporting portion of the base via the drive portion, so as to bend and fasten ends of the second positioning portions.

Abstract translation: 提供了一种用于将隔离盖组装到电路板的主体上的组装装置。 主体和隔离盖分别具有彼此对应的多个第一定位部和多个第二定位部。 第二定位部分别相应地穿过第一定位部。 组装装置包括基座，可移动地连接到基座的压配机构和设置在基座处的驱动机构。 底座具有用于设置隔离罩和主体的支撑部分。 压配机构具有面向支撑部的压配部。 驱动机构具有与压配机构连接的驱动部，驱动压配机构经由驱动部向基座的支撑部移动，从而弯曲并固定第二定位部的端部。

公开(公告)号：US07689732B2

公开(公告)日：2010-03-30

申请号：US11361737

申请日：2006-02-24

Applicant: Kuo-Ching Chen ,  Tai-Cheng Chen ,  Ming-Yih Duh ,  Li-Hsiang Wang

Inventor： Kuo-Ching Chen ,  Tai-Cheng Chen ,  Ming-Yih Duh ,  Li-Hsiang Wang

IPC: G06F13/28 ,  G06F13/20

CPC classification number: G06F13/28

Abstract: The invention provides a method improving flexibility of at least one direct memory access (DMA) channel. The at least one DMA channel is used by a plurality of DMA engines of a first device to direct data transmission between the plurality of DMA engines of the first device and a second device. An explanatory embodiment of the method comprises: allowing any of a plurality of DMA engines to use any of the at least one DMA channels, and enabling some of the plurality of DMA engines to share a target channel if some of the plurality of DMA engines simultaneously compete for the target channel, one of the at least one DMA channel.

Abstract translation: 本发明提供了一种提高至少一个直接存储器存取（DMA）通道的灵活性的方法。 所述至少一个DMA通道由第一设备的多个DMA引擎使用以指导第一设备的多个DMA引擎与第二设备之间的数据传输。 所述方法的说明性实施例包括：允许多个DMA引擎中的任何一个使用所述至少一个DMA通道中的任何一个，以及如果所述多个DMA引擎中的一些同时地使得所述多个DMA引擎中的一些可以共享目标通道 竞争目标频道，至少一个DMA频道之一。

公开(公告)号：US20100091471A1

公开(公告)日：2010-04-15

申请号：US12341560

申请日：2008-12-22

Applicant: Chung-Shao HUANG ,  Ching-Feng Hsieh ,  Jen-Huan Yu ,  Cheng-Wen Dai ,  Kuo-Ching Chen

Inventor： Chung-Shao HUANG ,  Ching-Feng Hsieh ,  Jen-Huan Yu ,  Cheng-Wen Dai ,  Kuo-Ching Chen

IPC: H05K7/02 ,  H05K9/00 ,  H05K7/00 ,  H05K3/00

CPC classification number: H05K9/0026 ,  Y10T29/49124

Abstract: The present invention provides a circuit board having an isolation cover and an assembling method thereof. The circuit board of the present invention comprises a main body and an isolation cover disposed on the circuit board main body. The main body and the isolation cover have a plurality of corresponding first and second positioning portions, and a ground portion is disposed on at least one side of each first positioning portion. The isolation cover is disposed on a first surface of the main body, and each second positioning portion passes through a second surface of the main body and each first positioning portion. An end of each second positioning portion is connected to each ground portion.

Abstract translation: 本发明提供一种具有隔离罩及其组装方法的电路板。 本发明的电路板包括设置在电路板主体上的主体和隔离盖。 主体和隔离盖具有多个对应的第一和第二定位部分，并且接地部分设置在每个第一定位部分的至少一侧上。 隔离盖设置在主体的第一表面上，并且每个第二定位部分穿过主体的第二表面和每个第一定位部分。 每个第二定位部分的端部连接到每个接地部分。

公开(公告)号：US20100089619A1

公开(公告)日：2010-04-15

申请号：US12341448

申请日：2008-12-22

Applicant: Kuo-Ching CHEN ,  Chung-Shao Huang ,  Ching-Feng Hsieh ,  Jen-Huan Yu ,  Cheng-Wen Dai

Inventor： Kuo-Ching CHEN ,  Chung-Shao Huang ,  Ching-Feng Hsieh ,  Jen-Huan Yu ,  Cheng-Wen Dai

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K9/0028 ,  H05K1/0256 ,  H05K3/301 ,  H05K3/341 ,  Y10T29/49124

Abstract: The present invention provides a circuit board of a communication product and a manufacturing method thereof. The circuit board comprises a main body of a circuit board and an isolation cover. A surface of the main body of the circuit board has a power transistor, an insulating layer, a plurality of first openings disposed at intervals on the insulating layer and around the power transistor, and a plurality of soldering portions exposed from the first openings respectively. The isolation cover comprises a cover body and a plurality of second openings equidistantly opened on a lateral side of the cover body. The isolation cover is disposed on the surface of the main body of the circuit board, and is soldered to the soldering portions through a local spot soldering process.

Abstract translation: 本发明提供通信产品的电路板及其制造方法。 电路板包括电路板的主体和隔离盖。 电路基板的主体的表面具有功率晶体管，绝缘层，间隔设置在绝缘层上并在功率晶体管周围的多个第一开口，以及分别从第一开口露出的多个焊接部。 隔离盖包括盖体和在盖体的侧面上等距开口的多个第二开口。 隔离盖设置在电路板的主体的表面上，并通过局部点焊工艺焊接到焊接部分。

公开(公告)号：US07233468B2

公开(公告)日：2007-06-19

申请号：US11162652

申请日：2005-09-19

Applicant: Chyh-Yih Chang ,  Kuo-Ching Chen

Inventor： Chyh-Yih Chang ,  Kuo-Ching Chen

IPC: H02H9/00

CPC classification number: H02H9/046

Abstract: A level shifter ESD protection circuit with power-on-sequence consideration used for receiving a first signal and outputting a second signal is provided. The level shifter circuit includes an inverter, a first switch, a second switch, a voltage level shifting circuit, a first ESD clamp and a second ESD clamp circuits. When the first power supply has been powered on and the second power supply is off, the first and second switches will remain off resulting from the power-off of the second power supply. Therefore, the second power source would not be affected by the first power supply because of passing through the ESD protection circuit.

Abstract translation: 提供了一种具有上电顺序考虑的电平移位器ESD保护电路，用于接收第一信号并输出​​第二信号。 电平移位器电路包括逆变器，第一开关，第二开关，电压电平移位电路，第一ESD钳位电路和第二ESD钳位电路。 当第一电源通电并且第二电源关闭时，由于第二电源的断电，第一和第二开关将保持关闭。 因此，由于通过ESD保护电路，第二电源不会受到第一电源的影响。

公开(公告)号：US20070014061A1

公开(公告)日：2007-01-18

申请号：US11162652

申请日：2005-09-19

Applicant: Chyh-Yih Chang ,  Kuo-Ching Chen

Inventor： Chyh-Yih Chang ,  Kuo-Ching Chen

IPC: H02H9/00

CPC classification number: H02H9/046

Abstract: A level shifter ESD protection circuit with power-on-sequence consideration used for receiving a first signal and outputting a second signal is provided. The level shifter circuit includes an inverter, a first switch, a second switch, a voltage level shifting circuit, a first ESD clamp and a second ESD clamp circuits. When the first power supply has been powered on and the second power supply is off, the first and second switches will remain off resulting from the power-off of the second power supply. Therefore, the second power source would not be affected by the first power supply because of passing through the ESD protection circuit.

Abstract translation: 提供了一种具有上电顺序考虑的电平移位器ESD保护电路，用于接收第一信号并输出​​第二信号。 电平移位器电路包括逆变器，第一开关，第二开关，电压电平移位电路，第一ESD钳位电路和第二ESD钳位电路。 当第一电源通电并且第二电源关闭时，由于第二电源的断电，第一和第二开关将保持关闭。 因此，由于通过ESD保护电路，第二电源不会受到第一电源的影响。

公开(公告)号：US08106302B2

公开(公告)日：2012-01-31

申请号：US12341448

申请日：2008-12-22

Applicant: Kuo-Ching Chen ,  Chung-Shao Huang ,  Ching-Feng Hsieh ,  Jen-Huan Yu ,  Cheng-Wen Dai

Inventor： Kuo-Ching Chen ,  Chung-Shao Huang ,  Ching-Feng Hsieh ,  Jen-Huan Yu ,  Cheng-Wen Dai

IPC: H05K1/00 ,  H05K1/11

CPC classification number: H05K9/0028 ,  H05K1/0256 ,  H05K3/301 ,  H05K3/341 ,  Y10T29/49124

Abstract: The present invention provides a circuit board of a communication product and a manufacturing method thereof. The circuit board comprises a main body of a circuit board and an isolation cover. A surface of the main body of the circuit board has a power transistor, an insulating layer, a plurality of first openings disposed at intervals on the insulating layer and around the power transistor, and a plurality of soldering portions exposed from the first openings respectively. The isolation cover comprises a cover body and a plurality of second openings equidistantly opened on a lateral side of the cover body. The isolation cover is disposed on the surface of the main body of the circuit board, and is soldered to the soldering portions through a local spot soldering process.

Abstract translation: 本发明提供通信产品的电路板及其制造方法。 电路板包括电路板的主体和隔离盖。 电路基板的主体的表面具有功率晶体管，绝缘层，间隔设置在绝缘层上并在功率晶体管周围的多个第一开口，以及分别从第一开口露出的多个焊接部。 隔离盖包括盖体和在盖体的侧面上等距开口的多个第二开口。 隔离盖设置在电路板的主体的表面上，并通过局部点焊工艺焊接到焊接部分。