发明授权
- 专利标题： Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same
- 专利标题（中）： 具有粘合挤出防止结构的半导体部件及其制造方法
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申请号： US12585704申请日： 2009-09-22
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公开(公告)号： US07999374B2公开(公告)日： 2011-08-16
- 发明人: Tsuyoshi So , Hideo Kubo , Seiji Ueno , Osamu Igawa
- 申请人： Tsuyoshi So , Hideo Kubo , Seiji Ueno , Osamu Igawa
- 申请人地址： JP Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki
- 代理机构： Fujitsu Patent Center
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L21/60 ; H01L23/02
摘要：
A semiconductor component includes a semiconductor element that has a plurality of signals, a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element, a heat conduction member that dissipates heat generated by the semiconductor element, a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element, a support member formed with an opening so as to surround the semiconductor element that supports the heat conduction member, a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board and a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member.