公开(公告)号：US20110254149A1

公开(公告)日：2011-10-20

申请号：US13171382

申请日：2011-06-28

申请人： Tsuyoshi So ,  Hideo Kubo ,  Seiji Ueno ,  Osamu Igawa

发明人： Tsuyoshi So ,  Hideo Kubo ,  Seiji Ueno ,  Osamu Igawa

IPC分类号： H01L23/40 ,  H01L21/58

CPC分类号： H01L23/3675 ,  H01L23/16 ,  H01L23/36 ,  H01L23/3735 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor component includes a semiconductor element that has a plurality of signals, a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element, a heat conduction member that dissipates heat generated by the semiconductor element, a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element, a support member formed with an opening so as to surround the semiconductor element that supports the heat conduction member, a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board and a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member.

摘要翻译： 半导体部件包括具有多个信号的半导体元件，配置在半导体元件的下方并且拉出半导体元件的多个信号的布线基板，散发由半导体元件产生的热量的导热部件， 连接构件，其设置在所述半导体元件和所述导热构件之间，并且将所述导热构件接合到所述半导体元件;支撑构件，形成有围绕所述半导体元件的开口，所述支撑构件支撑所述导热构件;第一粘合剂 构件，其设置在所述支撑构件和所述布线板之间，以将所述支撑构件与所述布线板接合;以及第二粘合构件，所述第二粘合构件设置在所述支撑构件和所述导热构件之间，以将所述支撑构件与所述导热构件接合。

公开(公告)号：US07999374B2

公开(公告)日：2011-08-16

申请号：US12585704

申请日：2009-09-22

申请人： Tsuyoshi So ,  Hideo Kubo ,  Seiji Ueno ,  Osamu Igawa

发明人： Tsuyoshi So ,  Hideo Kubo ,  Seiji Ueno ,  Osamu Igawa

IPC分类号： H01L23/34 ,  H01L21/60 ,  H01L23/02

CPC分类号： H01L23/3675 ,  H01L23/16 ,  H01L23/36 ,  H01L23/3735 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor component includes a semiconductor element that has a plurality of signals, a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element, a heat conduction member that dissipates heat generated by the semiconductor element, a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element, a support member formed with an opening so as to surround the semiconductor element that supports the heat conduction member, a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board and a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member.

摘要翻译： 半导体部件包括具有多个信号的半导体元件，配置在半导体元件的下方并且拉出半导体元件的多个信号的布线基板，散发由半导体元件产生的热量的导热部件， 连接构件，其设置在所述半导体元件和所述导热构件之间，并且将所述导热构件接合到所述半导体元件;支撑构件，形成有围绕所述半导体元件的开口，所述支撑构件支撑所述导热构件;第一粘合剂 构件，其设置在所述支撑构件和所述布线板之间，以将所述支撑构件与所述布线板接合;以及第二粘合构件，所述第二粘合构件设置在所述支撑构件和所述导热构件之间，以将所述支撑构件与所述导热构件接合。

公开(公告)号：US20100013089A1

公开(公告)日：2010-01-21

申请号：US12585704

申请日：2009-09-22

申请人： Tsuyoshi So ,  Hideo Kubo ,  Seiji Ueno ,  Osamu Igawa

发明人： Tsuyoshi So ,  Hideo Kubo ,  Seiji Ueno ,  Osamu Igawa

IPC分类号： H01L23/34 ,  H01L21/60

CPC分类号： H01L23/3675 ,  H01L23/16 ,  H01L23/36 ,  H01L23/3735 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor component includes a semiconductor element that has a plurality of signals, a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element, a heat conduction member that dissipates heat generated by the semiconductor element, a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element, a support member formed with an opening so as to surround the semiconductor element that supports the heat conduction member, a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board and a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member.

摘要翻译： 半导体部件包括具有多个信号的半导体元件，配置在半导体元件的下方并且拉出半导体元件的多个信号的布线基板，散发由半导体元件产生的热量的导热部件， 连接构件，其设置在所述半导体元件和所述导热构件之间，并且将所述导热构件接合到所述半导体元件;支撑构件，形成有围绕所述半导体元件的开口，所述支撑构件支撑所述导热构件;第一粘合剂 构件，其设置在所述支撑构件和所述布线板之间，以将所述支撑构件与所述布线板接合;以及第二粘合构件，所述第二粘合构件设置在所述支撑构件和所述导热构件之间，以将所述支撑构件与所述导热构件接合。

公开(公告)号：US08421219B2

公开(公告)日：2013-04-16

申请号：US13171382

申请日：2011-06-28

申请人： Tsuyoshi So ,  Hideo Kubo ,  Seiji Ueno ,  Osamu Igawa

发明人： Tsuyoshi So ,  Hideo Kubo ,  Seiji Ueno ,  Osamu Igawa

IPC分类号： H01L23/34 ,  H01L23/60 ,  H01L23/02

CPC分类号： H01L23/3675 ,  H01L23/16 ,  H01L23/36 ,  H01L23/3735 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor component includes a semiconductor element that has a plurality of signals, a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element, a heat conduction member that dissipates heat generated by the semiconductor element, a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element, a support member formed with an opening so as to surround the semiconductor element that supports the heat conduction member, a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board and a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member.

摘要翻译： 半导体部件包括具有多个信号的半导体元件，配置在半导体元件的下方并且拉出半导体元件的多个信号的布线基板，散发由半导体元件产生的热量的导热部件， 连接构件，其设置在所述半导体元件和所述导热构件之间，并且将所述导热构件接合到所述半导体元件;支撑构件，形成有围绕所述半导体元件的开口，所述支撑构件支撑所述导热构件;第一粘合剂 构件，其设置在所述支撑构件和所述布线板之间，以将所述支撑构件与所述布线板接合;以及第二粘合构件，所述第二粘合构件设置在所述支撑构件和所述导热构件之间，以将所述支撑构件与所述导热构件接合。

公开(公告)号：US07813133B2

公开(公告)日：2010-10-12

申请号：US11359996

申请日：2006-02-23

申请人： Makoto Iijima ,  Seiji Ueno ,  Osamu Igawa

发明人： Makoto Iijima ,  Seiji Ueno ,  Osamu Igawa

IPC分类号： H05K7/20

CPC分类号： H01L23/42 ,  H01L23/3675 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  Y10T428/12389 ,  Y10T428/24926 ,  Y10T428/24942

摘要： A semiconductor device includes a board, a semiconductor element mounted on one of main surfaces of the board, a plurality of passive elements provided in the vicinity of the semiconductor element, and a heat radiation plate mounted above the board and connected to a rear surface of the semiconductor element via a heat conductive material. A surface roughness of a surface of the heat radiation plate which surface comes in contact with the heat conductive material is non-uniform at a whole of the surface.

摘要翻译： 半导体器件包括：板，安装在板的主表面之一中的半导体元件，设置在半导体元件附近的多个无源元件;以及安装在板上方并连接到半导体元件的背面的散热板 该半导体元件经由导热材料。 表面与导热材料接触的散热板的表面的表面粗糙度在整个表面上是不均匀的。

公开(公告)号：US20070139892A1

公开(公告)日：2007-06-21

申请号：US11359996

申请日：2006-02-23

申请人： Makoto Iijima ,  Seiji Ueno ,  Osamu Igawa

发明人： Makoto Iijima ,  Seiji Ueno ,  Osamu Igawa

IPC分类号： H05K7/20

CPC分类号： H01L23/42 ,  H01L23/3675 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  Y10T428/12389 ,  Y10T428/24926 ,  Y10T428/24942

摘要： A semiconductor device includes a board, a semiconductor element mounted on one of main surfaces of the board, a plurality of passive elements provided in the vicinity of the semiconductor element, and a heat radiation plate mounted above the board and connected to a rear surface of the semiconductor element via a heat conductive material. A surface roughness of a surface of the heat radiation plate which surface comes in contact with the heat conductive material is non-uniform at a whole of the surface.

摘要翻译： 半导体器件包括：板，安装在板的主表面之一中的半导体元件，设置在半导体元件附近的多个无源元件;以及安装在板上方并连接到半导体元件的背面的散热板 该半导体元件经由导热材料。 表面与导热材料接触的散热板的表面的表面粗糙度在整个表面上是不均匀的。

公开(公告)号：US06351031B1

公开(公告)日：2002-02-26

申请号：US09533173

申请日：2000-03-22

申请人： Makoto Iijima ,  Masaru Nukiwa ,  Seiji Ueno ,  Muneharu Morioka

发明人： Makoto Iijima ,  Masaru Nukiwa ,  Seiji Ueno ,  Muneharu Morioka

IPC分类号： H01L2304

CPC分类号： H05K3/4635 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3157 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16195 ,  H05K1/0393 ,  H05K3/205 ,  H05K3/386 ,  H05K3/423 ,  H05K3/4617 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2203/016 ,  H05K2203/063 ,  H05K2203/0733 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor device includes a multi-flexible substrate and semiconductor chips mounted thereon. The multi-flexible substrate is configured such that organic insulation substrate layers and filmy adhesive layers are alternatively stacked together and wiring layers formed therein are interconnected by means of vias. Each of the vias consisting of a via-hole which is formed penetrating both the organic insulation substrate layers and the filmy adhesive layers and a metal via member 26 which is provided in the via-hole and made of an identical material. A method of manufacturing the multi-flexible substrate for the semiconductor device is also disclosed.

摘要翻译： 半导体器件包括安装在其上的多柔性基板和半导体芯片。 多柔性基板被配置为使得有机绝缘基底层和膜状粘合剂层交替堆叠在一起，并且其中形成的布线层通过通孔相互连接。 每个通孔由穿透有机绝缘基底层和薄膜粘合剂层的通孔组成，以及设置在通孔中并由相同材料制成的金属通孔构件26。 还公开了制造用于半导体器件的多柔性基板的方法。

公开(公告)号：US07591204B2

公开(公告)日：2009-09-22

申请号：US10960063

申请日：2004-10-08

申请人： Seiji Ueno ,  Kazuo Chikaraishi

发明人： Seiji Ueno ,  Kazuo Chikaraishi

IPC分类号： F16H35/00

CPC分类号： F16H57/12 ,  B62D5/0409 ,  B62D5/0424 ,  B62D5/0448 ,  F16H1/08 ,  F16H7/023

摘要： A belt speed reducing apparatus for an electric power steering apparatus includes a drive pulley having a first helical gear, a driven pulley having a second helical gear and a drive belt having a third helical gear in which a relationship of tan β

摘要翻译： 一种用于电动助力转向装置的皮带减速装置包括具有第一斜齿轮的驱动滑轮，具有第二斜齿轮的从动皮带轮和具有第三斜齿轮的传动皮带，其中，在第三斜齿轮之间建立了tanβ< 相应螺旋齿轮的扭转角β和第一或第二斜齿轮与第三斜齿轮之间的摩擦系数μ。 另外，一种电动助力转向装置，用于调节彼此啮合的减速装置的齿轮之间的间隙，或者调节减速装置的带的张力。

公开(公告)号：US20060157294A1

公开(公告)日：2006-07-20

申请号：US11318537

申请日：2005-12-28

申请人： Seiji Ueno ,  Kazuo Chikaraishi

发明人： Seiji Ueno ,  Kazuo Chikaraishi

IPC分类号： B62D5/04

CPC分类号： F16H55/283 ,  B62D3/123 ,  F16H55/285

摘要： Due to the meshing of the gears, the following force works on the rack. A separating force (Fα) determined by a pressure angle of gears, a lateral force (Fβ) determined by an angle of torsion of the rack, and drag (Fr) for offsetting angular moment occurring in the rack due to the lateral force (Fβ). A resultant (F) of the force works from the rack on the rack guide. When the line of this resultant (F) is held on the “inner side” of the end portions of the needle bearing 25 in this rolling type rack guide 21, the rotation of the roller 22 becomes stable.

摘要翻译： 由于齿轮的啮合，以下力在机架上工作。 由齿轮的压力角确定的分离力（Falpha），由齿条的扭转角度确定的横向力（Fbeta）以及由于侧向力而产生在齿条中的角力矩的阻力（Fr）（Fbeta ）。 力的结果（F）从机架导轨上的机架工作。 当该结果（F）的线被保持在该滚动型齿条引导件21中的滚针轴承25的端部的“内侧”上时，辊22的旋转变得稳定。

公开(公告)号：US20150041240A1

公开(公告)日：2015-02-12

申请号：US14233380

申请日：2012-10-01

申请人： Seiji Ueno

发明人： Seiji Ueno

IPC分类号： B62D3/12 ,  F16H57/028 ,  B62D5/04

CPC分类号： B62D3/12 ,  B62D5/0409 ,  F16C35/067 ,  F16C2226/60 ,  F16C2326/24 ,  F16H19/04 ,  F16H55/283 ,  F16H57/021 ,  F16H57/028

摘要： A steering apparatus has a pinion shaft that transmits rotation of a steering wheel to a rack shaft, a bearing that is internally fitted to the housing, rotatably supports one end of the pinion shaft on the housing, and bears a radial load and a thrust load acting on the pinion shaft, and a retaining ring that is internally fitted to an annular groove provided on the inner circumferential surface of the housing and has a C-shaped part and an opening defined by two opposed ends of the C-shaped part, the C-shaped part being in contact with an end face of an outer ring of the bearing to thereby fix the outer ring of the bearing to the housing. The retaining ring is internally fitted to the annular groove in such a way that the opening faces toward the rack teeth as seen from an axial direction of the pinion shaft.

摘要翻译： 转向装置具有将方向盘的旋转传递到齿条轴的小齿轮轴，内部配合到壳体的轴承，将小齿轮轴的一端可旋转地支撑在壳体上，并且承受径向载荷和推力载荷 作用在小齿轮轴上，以及保持环，其内部配合到设置在壳体的内周面上的环形槽，并具有由C形部分的两个相对端限定的C形部分和开口， C形部分与轴承的外圈的端面接触，从而将轴承的外圈固定到壳体。 保持环以环形槽内嵌的方式使得从小齿轮轴的轴向方向看，开口面向齿条齿。