Invention Grant
US08000158B2 Semiconductor memory device including repair redundancy memory cell arrays 失效
包括修复冗余存储单元阵列的半导体存储器件

  • Patent Title: Semiconductor memory device including repair redundancy memory cell arrays
  • Patent Title (中): 包括修复冗余存储单元阵列的半导体存储器件
  • Application No.: US12490690
    Application Date: 2009-06-24
  • Publication No.: US08000158B2
    Publication Date: 2011-08-16
  • Inventor: Joong-Ho Lee
  • Applicant: Joong-Ho Lee
  • Applicant Address: KR Gyeonggi-do
  • Assignee: Hynix Semiconductor Inc.
  • Current Assignee: Hynix Semiconductor Inc.
  • Current Assignee Address: KR Gyeonggi-do
  • Agency: IP & T Group LLP
  • Priority: KR10-2009-0041589 20090513
  • Main IPC: G11C7/00
  • IPC: G11C7/00
Semiconductor memory device including repair redundancy memory cell arrays
Abstract:
A semiconductor memory device includes a plurality of memory cell matrixes each of which contains plural memory cell arrays whose number is lager than 2n and smaller than 2n+1, n being a natural number. The semiconductor memory device includes normal memory cell arrays including 2m numbers of memory cell arrays of the plurality of memory cell matrixes, m being a bit of addresses, wherein a data access operation is performed on normal memory cells in the normal memory cell arrays as normal word lines corresponding to the normal memory cells are activated in response to the addresses, and additional redundancy memory cell arrays in the plurality of memory cell matrixes, wherein repair-expected memory cells in the normal memory cell arrays are replaced with the additional redundancy memory cell arrays as redundancy word lines corresponding to the additional redundancy memory cells are activated in response to the addresses corresponding to the repair-expected memory cells.
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