摘要:
An exclusive OR circuit includes, inter alia: a low pass unit configured to apply a second data to an output node when a first data is at a low level and to apply the first data to the output node when the second data is at a low level, and a discharge unit configured to discharge a voltage level of the output node when the first and second data are at a high level.
摘要:
Disclosed are a head-mounted display apparatus and a contents display method. The head-mounted display apparatus includes: a mobile device tracing information processing unit for receiving position information or orientation information of a mobile device and generating tracing information of the mobile device based on the received position information or orientation information of the mobile device; a gesture processing unit for receiving input information of the mobile device and generating gesture information to change an output format of contents by using the received input information; a rendering unit for generating a predetermined virtually augmented contents image based on the tracing information of the mobile device and the gesture information; and a display unit for displaying the generated virtually augmented contents image.
摘要:
A semiconductor memory device includes a plurality of memory cell matrixes each of which contains plural memory cell arrays whose number is lager than 2n and smaller than 2n+1, n being a natural number. The semiconductor memory device includes normal memory cell arrays including 2m numbers of memory cell arrays of the plurality of memory cell matrixes, m being a bit of addresses, wherein a data access operation is performed on normal memory cells in the normal memory cell arrays as normal word lines corresponding to the normal memory cells are activated in response to the addresses, and additional redundancy memory cell arrays in the plurality of memory cell matrixes, wherein repair-expected memory cells in the normal memory cell arrays are replaced with the additional redundancy memory cell arrays as redundancy word lines corresponding to the additional redundancy memory cells are activated in response to the addresses corresponding to the repair-expected memory cells.
摘要:
A semiconductor memory device includes first and second sub-memory-cell areas configured to form a memory cell matrix and include a first bit line and a second bit line respectively to form a data transfer path corresponding to a predetermined memory cell, an additional bit line configured to cross the first sub-memory-cell area and form a data transfer path by being connected with the second bit line and a sensing and amplifying unit configured to sense and amplify data inputted through the additional bit line and the first bit line.
摘要:
A semiconductor memory includes a cell mat configured to include a plurality of memory cells to which a first bit line pair or a second bit line pair is connected; a sense amplifier configured to amplify a positive sensing line and a negative sensing line in response to a first bit line equalize signal; a column selecting unit configured to connect the positive sensing line and the negative sensing line to a first data bus and a second data bus, respectively, in response to a column selection signal; and a share control unit configured to connect the positive sensing line and a positive first bit line of the first bit line pair or a positive second bit line of the second bit line pair in response to a second bit line equalize signal, a positive share control signal and a negative share control signal.
摘要:
An exclusive OR circuit includes, inter alia: a low pass unit configured to apply a second data to an output node when a first data is at a low level and to apply the first data to the output node when the second data is at a low level, and a discharge unit configured to discharge a voltage level of the output node when the first and second data are at a high level.
摘要:
Various embodiments of a memory system are disclosed. In one exemplary embodiment, the memory system may include a semiconductor memory apparatus configured to generate error check signals in a column direction and a row direction of data groups to be transmitted through a plurality of data input/output terminals in a read operation and output the error check signals together with the data groups, and a memory controller configured to control data read/write operations of the semiconductor memory apparatus, generate error check signals by performing error check in a column direction and a row direction of data groups to be transmitted in a write operation, and provide the error check signals to the semiconductor memory apparatus together with the data groups.
摘要:
A semiconductor memory device includes first and second sub-memory-cell areas configured to form a memory cell matrix and include a first bit line and a second bit line respectively to form a data transfer path corresponding to a predetermined memory cell, an additional bit line configured to cross the first sub-memory-cell area and form a data transfer path by being connected with the second bit line and a sensing and amplifying unit configured to sense and amplify data inputted through the additional bit line and the first bit line.
摘要:
A memory module includes a plurality of ranks that each include a first pin group and a second pin group for receiving external pin signals, and a rank selecting unit included in each of the plurality of ranks, the rank selecting unit configured to output different rank pin signals to each rank by using signals of the first pin group.
摘要:
An apparatus and method for separating and connecting a main camera and a sub camera in a portable terminal are provided. The portable terminal includes a main camera for receiving a main clock signal from a main chip and transmitting a main camera pixel clock signal to the main chip in response to the main clock signal, a sub camera for receiving the main clock signal from the main chip and transmitting a sub camera pixel clock signal to the main chip in response to the main clock signal, and a switch for configuring a path from the main chip to at least one of the main camera and the sub camera.