发明授权
US08003496B2 Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die
有权
半导体器件和将半导体管芯安装到临时载体上的散热器并在模具上形成聚合物层和导电层的方法
- 专利标题： Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die
- 专利标题（中）： 半导体器件和将半导体管芯安装到临时载体上的散热器并在模具上形成聚合物层和导电层的方法
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申请号： US12541334申请日： 2009-08-14
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公开(公告)号： US08003496B2公开(公告)日： 2011-08-23
- 发明人: JiHoon Oh , SinJae Lee , JinGwan Kim
- 申请人： JiHoon Oh , SinJae Lee , JinGwan Kim
- 申请人地址： SG
- 专利权人： STATS ChipPAC, Ltd.
- 当前专利权人： STATS ChipPAC, Ltd.
- 当前专利权人地址： SG
- 代理机构： Patent Law Group
- 代理商 Robert D. Atkins
- 主分类号： H01L23/10
- IPC分类号： H01L23/10 ; H01L21/00
摘要：
A semiconductor device is made by forming a heat spreader over a temporary carrier. A semiconductor die is mounted to the heat spreader. A first polymer layer is formed over the semiconductor die and heat spreader. A first conductive layer is formed over the first polymer layer. The first conductive layer is connected to the heat spreader and contact pads on the semiconductor die. A second polymer layer is formed over the first conductive layer. A second conductive layer is formed over the second polymer layer. The second conductive layer is electrically connected to the first conductive layer. Bumps are formed through a solder masking layer on the second conductive layer. The temporary carrier is removed. The heat spreader dissipates heat from the semiconductor die and provides shielding from inter-device interference. The heat spreader is grounded through the first and second conductive layers.
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