发明授权
- 专利标题： Semiconductor device and fabrication method
- 专利标题（中）： 半导体器件及其制造方法
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申请号： US12102414申请日： 2008-04-14
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公开(公告)号： US08004074B2公开(公告)日： 2011-08-23
- 发明人: Kentaro Mori , Katsumi Kikuchi , Shintaro Yamamichi
- 申请人： Kentaro Mori , Katsumi Kikuchi , Shintaro Yamamichi
- 申请人地址： JP Tokyo
- 专利权人： NEC Corporation
- 当前专利权人： NEC Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Young & Thompson
- 优先权： JP2007-105852 20070413
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
A semiconductor device, in which a semiconductor element is mounted on one side of a circuit board that is made up from an insulating layer and a wiring layer, includes metal posts provided on the side of the circuit board on which the semiconductor element is mounted; and a sealing layer provided on the side of the circuit board on which the semiconductor element is mounted such that the semiconductor element is covered and such that only portions of the metal posts are exposed.
公开/授权文献
- US20080284001A1 SEMICONDUCTOR DEVICE AND FABRICATION METHOD 公开/授权日：2008-11-20
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