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发明授权
US08004081B2 Semiconductor chip package and printed circuit board having through interconnections 失效
具有通过互连的半导体芯片封装和印刷电路板

Semiconductor chip package and printed circuit board having through interconnections
摘要：
A semiconductor chip package includes a signal interconnection penetrating a semiconductor chip and transmitting a signal to the semiconductor chip and a power interconnection and a ground interconnection penetrating the semiconductor and supplying power and ground to the semiconductor chip. The power interconnection and the ground interconnection are arranged to neighbor each other adjacent to the signal interconnection.
摘要（中）：

半导体芯片封装包括穿透半导体芯片并将信号传输到半导体芯片的信号互连以及穿透半导体的电源互连和接地互连，并向半导体芯片供电和接地。 电源互连和接地互连被布置成邻近信号互连相邻。

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