发明授权
US08008716B2 Inverted-trench grounded-source FET structure with trenched source body short electrode
有权
反沟槽接地源FET结构,具有沟槽源体短路电极
- 专利标题: Inverted-trench grounded-source FET structure with trenched source body short electrode
- 专利标题(中): 反沟槽接地源FET结构,具有沟槽源体短路电极
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申请号: US11522669申请日: 2006-09-17
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公开(公告)号: US08008716B2公开(公告)日: 2011-08-30
- 发明人: Sik K Lui , François Hébert , Anup Bhalla
- 申请人: Sik K Lui , François Hébert , Anup Bhalla
- 申请人地址: BM
- 专利权人: Alpha & Omega Semiconductor, Ltd
- 当前专利权人: Alpha & Omega Semiconductor, Ltd
- 当前专利权人地址: BM
- 代理商 Bo-In Lin
- 主分类号: H01L29/66
- IPC分类号: H01L29/66
摘要:
This invention discloses bottom-source lateral diffusion MOS (BS-LDMOS) device. The device has a source region disposed laterally opposite a drain region near a top surface of a semiconductor substrate supporting a gate thereon between the source region and a drain region. The BS-LDMOS device further has a combined sinker-channel region disposed at a depth in the semiconductor substrate entirely below a body region disposed adjacent to the source region near the top surface wherein the combined sinker-channel region functioning as a buried source-body contact for electrically connecting the body region and the source region to a bottom of the substrate functioning as a source electrode. A drift region is disposed near the top surface under the gate and at a distance away from the source region and extending to and encompassing the drain region. The combined sinker-channel region extending below the drift region and the combined sinker-channel region that has a dopant-conductivity opposite to and compensating the drift region for reducing the source-drain capacitance.
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