发明授权
- 专利标题： Mold, imprint apparatus, and process for producing structure
- 专利标题（中）： 模具，压印设备和生产结构的过程
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申请号： US11468870申请日： 2006-08-31
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公开(公告)号： US08011916B2公开(公告)日： 2011-09-06
- 发明人: Nobuhito Suehira , Junichi Seki
- 申请人： Nobuhito Suehira , Junichi Seki
- 申请人地址： JP Tokyo
- 专利权人： Canon Kabushiki Kaisha
- 当前专利权人： Canon Kabushiki Kaisha
- 当前专利权人地址： JP Tokyo
- 代理机构： Fitzpatrick, Cella, Harper & Scinto
- 优先权： JP2005/257431 20050906
- 主分类号： B29C59/00
- IPC分类号： B29C59/00 ; B29C35/08
摘要：
In order to alleviate or suppress curing of a photocurable resin material in an area in which the curing of the photocurable resin material is not intended, exposure of the photocurable resin material to light is suppressed through a non-pattern portion at which a light-blocking member is provided by means of a mold having an imprint pattern portion and the non-pattern portion or is suppressed by disposing a light-blocking member so as not to irradiate the photocurable resin material with light not via the mold.
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