发明授权
- 专利标题： Compression molding of an electronic device
- 专利标题（中）： 电子设备的压缩成型
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申请号： US11746291申请日： 2007-05-09
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公开(公告)号： US08011917B2公开(公告)日： 2011-09-06
- 发明人: Ji Yuan Hao , See Yap Ong , Jian Xiong Su , Teng Hock Kuah , Ee Ling Chiw
- 申请人： Ji Yuan Hao , See Yap Ong , Jian Xiong Su , Teng Hock Kuah , Ee Ling Chiw
- 申请人地址： SG Singapore
- 专利权人： ASM Technology Singapore Pte Ltd
- 当前专利权人： ASM Technology Singapore Pte Ltd
- 当前专利权人地址： SG Singapore
- 代理机构： Ostrolenk Faber LLP
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; A01J21/00
摘要：
A compression molding system comprising first and second mold halves is provided for an electronic device wherein a plurality of cavities are formed in the first mold half corresponding to molding locations on the electronic device. A plurality of plungers are located in the first mold half, each of which is drivable against a side of a respective cavity for applying a compacting force to encapsulation material located in the cavity during molding. A motor is operatively connected to the plungers for driving the plungers relative to the cavities.
公开/授权文献
- US20080277829A1 COMPRESSION MOLDING OF AN ELECTRONIC DEVICE 公开/授权日：2008-11-13
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