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公开(公告)号：US08011917B2
公开(公告)日：2011-09-06
申请号：US11746291
申请日：2007-05-09
申请人： Ji Yuan Hao , See Yap Ong , Jian Xiong Su , Teng Hock Kuah , Ee Ling Chiw
发明人： Ji Yuan Hao , See Yap Ong , Jian Xiong Su , Teng Hock Kuah , Ee Ling Chiw
CPC分类号： B29C43/18 , B29C33/0022 , B29C33/10 , B29C33/68 , B29C43/361 , B29C2043/3623 , B29K2105/0002
摘要： A compression molding system comprising first and second mold halves is provided for an electronic device wherein a plurality of cavities are formed in the first mold half corresponding to molding locations on the electronic device. A plurality of plungers are located in the first mold half, each of which is drivable against a side of a respective cavity for applying a compacting force to encapsulation material located in the cavity during molding. A motor is operatively connected to the plungers for driving the plungers relative to the cavities.
摘要翻译： 包括第一和第二半模的压缩模制系统被提供用于电子设备，其中在对应于电子设备上的模制位置的第一半模中形成多个空腔。 多个柱塞位于第一半模中，每个活塞可以相对于相应空腔的侧面驱动，用于在模制期间对位于空腔中的封装材料施加压实力。 马达可操作地连接到柱塞，用于相对于空腔驱动柱塞。
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公开(公告)号：US20080277829A1
公开(公告)日：2008-11-13
申请号：US11746291
申请日：2007-05-09
申请人： Ji Yuan HAO , See Yap ONG , Jian Xiong SU , Teng Hock KUAH , Ee Ling CHIW
发明人： Ji Yuan HAO , See Yap ONG , Jian Xiong SU , Teng Hock KUAH , Ee Ling CHIW
IPC分类号： B28B1/44
CPC分类号： B29C43/18 , B29C33/0022 , B29C33/10 , B29C33/68 , B29C43/361 , B29C2043/3623 , B29K2105/0002
摘要： A compression molding system comprising first and second mold halves is provided for an electronic device wherein a plurality of cavities are formed in the first mold half corresponding to molding locations on the electronic device. A plurality of plungers are located in the first mold half, each of which is drivable against a side of a respective cavity for applying a compacting force to encapsulation material located in the cavity during molding. A motor is operatively connected to the plungers for driving the plungers relative to the cavities.
摘要翻译： 包括第一和第二半模的压缩模制系统被提供用于电子设备，其中在对应于电子设备上的模制位置的第一半模中形成多个空腔。 多个柱塞位于第一半模中，每个活塞可以相对于相应空腔的侧面驱动，用于在模制期间对位于空腔中的封装材料施加压实力。 马达可操作地连接到柱塞，用于相对于空腔驱动柱塞。
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公开(公告)号：US09427893B2
公开(公告)日：2016-08-30
申请号：US14489640
申请日：2014-09-18
CPC分类号： B29C33/308 , B29C33/307 , B29C43/18 , B29C43/32 , B29C43/36 , B29C2043/5858 , B30B1/103 , B30B15/007 , B30B15/067 , H01L21/56 , H01L21/565
摘要： Disclosed is a platen for a molding press for encapsulating semiconductor dies on a substrate, the platen comprising: a first mold chase having a first mold chase surface; the platen being operable to cooperate with a further platen having a second mold chase with a second mold chase surface to clamp a substrate, which is held against a substrate-facing surface relating to either the first or second mold chase surface, between the first and second mold chase surfaces to define at least one mold cavity with respect to the substrate; wherein the platen further comprises a rotational mounting device on which either the first or second mold chase is rotatable about at least one axis passing through the center of the substrate-facing surface to adjust the relative arrangement of the first and second mold chase surfaces. Also disclosed is a molding press comprising the platen, and the further platen cooperating with the platen.
摘要翻译： 公开了一种用于将半导体管芯封装在基板上的模压机的压板，所述压板包括：具有第一模具走向表面的第一模具追逐; 所述压板可操作以与具有第二模具追逐的另一个压板配合，其具有第二模具走走表面，以夹紧基板，所述基板保持在与第一或第二模具追逐表面相关的面向基板的表面上， 第二模具追逐表面以相对于所述基板限定至少一个模腔; 其中所述压板还包括旋转安装装置，所述第一或第二模具追逐可以围绕穿过所述面向衬底的表面的中心的至少一个轴线旋转，以调整所述第一和第二模具走走表面的相对布置。 还公开了一种成型压力机，其包括压板，并且另外的压板与压板配合。
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公开(公告)号：US20160082624A1
公开(公告)日：2016-03-24
申请号：US14489640
申请日：2014-09-18
CPC分类号： B29C33/308 , B29C33/307 , B29C43/18 , B29C43/32 , B29C43/36 , B29C2043/5858 , B30B1/103 , B30B15/007 , B30B15/067 , H01L21/56 , H01L21/565
摘要： Disclosed is a platen for a molding press for encapsulating semiconductor dies on a substrate, the platen comprising: a first mold chase having a first mold chase surface; the platen being operable to cooperate with a further platen having a second mold chase with a second mold chase surface to clamp a substrate, which is held against a substrate-facing surface relating to either the first or second mold chase surface, between the first and second mold chase surfaces to define at least one mold cavity with respect to the substrate; wherein the platen further comprises a rotational mounting device on which either the first or second mold chase is rotatable about at least one axis passing through the centre of the substrate-facing surface to adjust the relative arrangement of the first and second mold chase surfaces. Also disclosed is a molding press comprising the platen, and the further platen cooperating with the platen.
摘要翻译： 公开了一种用于将半导体管芯封装在基板上的模压机的压板，所述压板包括：具有第一模具走向表面的第一模具追逐; 所述压板可操作以与具有第二模具追逐的另一个压板配合，其具有第二模具走走表面，以夹紧基板，所述基板保持在与第一或第二模具追逐表面相关的面向基板的表面上， 第二模具追逐表面以相对于所述基板限定至少一个模腔; 其中所述压板还包括旋转安装装置，所述第一或第二模具追逐可以围绕穿过所述面向衬底的表面的中心的至少一个轴线旋转，以调整所述第一和第二模具走走表面的相对布置。 还公开了一种成型压力机，其包括压板，并且另外的压板与压板配合。
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