发明授权
- 专利标题: Surface wave excitation plasma processing system
- 专利标题(中): 表面波激发等离子体处理系统
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申请号: US11910202申请日: 2006-04-26
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公开(公告)号: US08018162B2公开(公告)日: 2011-09-13
- 发明人: Masayasu Suzuki , Tetsuya Saruwatari
- 申请人: Masayasu Suzuki , Tetsuya Saruwatari
- 申请人地址: JP Kyoto
- 专利权人: Shimadzu Corporation
- 当前专利权人: Shimadzu Corporation
- 当前专利权人地址: JP Kyoto
- 代理机构: J.C. Patents
- 优先权: JP2005-139454 20050512
- 国际申请: PCT/JP2006/308732 WO 20060426
- 国际公布: WO2006/120904 WO 20061116
- 主分类号: H05B31/26
- IPC分类号: H05B31/26
摘要:
To sustain uniform generation of plasma constantly over a large area. In the surface wave excitation plasma processing device, a plasma source includes: a microwave generator, a microwave waveguide and a dielectric block; and a plasma source also includes: a microwave generator, a microwave waveguide and a dielectric block. The lid of a chamber is fixed onto the microwave waveguides in parallel, and the dielectric blocks disposed in the chamber. A reflecting plate is disposed between the dielectric blocks so that electromagnetic waves propagating through the dielectric blocks are prevented from advancing into the counterpart dielectric blocks as reflected waves. Consequently, the plasma sources are controlled independently. Furthermore, a side reflector is disposed at outer circumference of each of the dielectric blocks so that a standing waves of the electromagnetic waves propagating through the dielectric blocks is formed thus forming a large area standing wave mode of surface waves uniformly.
公开/授权文献
- US20090232715A1 SURFACE WAVE EXCITATION PLASMA PROCESSING SYSTEM 公开/授权日:2009-09-17
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