Invention Grant
- Patent Title: Methods and systems for reducing heat flux in memory systems
- Patent Title (中): 用于减少存储器系统中热通量的方法和系统
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Application No.: US12557361Application Date: 2009-09-10
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Publication No.: US08018789B2Publication Date: 2011-09-13
- Inventor: Steven C. Woo , Craig E. Hampel
- Applicant: Steven C. Woo , Craig E. Hampel
- Applicant Address: US CA Los Altos
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Current Assignee Address: US CA Los Altos
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: G11C5/14
- IPC: G11C5/14
Abstract:
The memory module includes front and back faces. Multiple devices are disposed on each of the faces. A first control line serially connects a first group of devices on both the front and back faces so that the first group of devices commonly contribute multiple bits to a data bus. A second control line serially connects a second group of devices on both the front and back faces so that the second group of devices commonly contribute multiple bits to a data bus.
Public/Granted literature
- US20090323386A1 Methods and Systems for Reducing Heat Flux in Memory Systems Public/Granted day:2009-12-31
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