Invention Grant
- Patent Title: Low thermal expansion glass for EUVL applications
- Patent Title (中): 用于EUVL应用的低热膨胀玻璃
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Application No.: US12862965Application Date: 2010-08-25
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Publication No.: US08021755B2Publication Date: 2011-09-20
- Inventor: Kenneth Edward Hrdina , Michael A Mueller , Barbara L Stainbrook
- Applicant: Kenneth Edward Hrdina , Michael A Mueller , Barbara L Stainbrook
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent Walter M. Douglas
- Main IPC: B32B17/06
- IPC: B32B17/06

Abstract:
A low thermal expansion glass includes a base glass material having a front surface, a back surface, and a thickness and a glass coating material applied on at least the front surface of the base glass material. The base glass material consists essentially 10 wt % to 20 wt % titania and 80 wt % to 90 wt % silica. The glass coating material also consists essentially of titania and silica, but the total amount of titania in the glass coating material is lower than the total amount of titania in the base glass material. A silica-titania glass element suitable for extreme ultraviolet lithography applications consists of 12 wt % to 20 wt % titania and 80 wt % to 88 wt % silica and has a coefficient of thermal expansion of essentially 0 ΔL/L in a temperature range of −20° C. to +100° C.
Public/Granted literature
- US20110052869A1 LOW THERMAL EXPANSION GLASS FOR EUVL APPLICATIONS Public/Granted day:2011-03-03
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