发明授权
- 专利标题： Silicone resin composition for optical semiconductor devices
- 专利标题（中）： 用于光学半导体器件的硅树脂组合物
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申请号： US12569433申请日： 2009-09-29
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公开(公告)号： US08022137B2公开(公告)日： 2011-09-20
- 发明人: Yusuke Taguchi , Junichi Sawada , Kenji Hagiwara , Shoichi Osada , Kazutoshi Tomiyoshi
- 申请人： Yusuke Taguchi , Junichi Sawada , Kenji Hagiwara , Shoichi Osada , Kazutoshi Tomiyoshi
- 申请人地址： JP Tokyo
- 专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 优先权： JP2008-253764 20080930; JP2009-200919 20090831
- 主分类号： C08L83/00
- IPC分类号： C08L83/00
摘要：
The present invention provides a silicone resin composition for an optical semiconductor device, comprising (A) 100 parts by mass of an organopolysiloxane having a weight average molecular weight of from 500 to 20000, reduced to polystyrene, and represented by the following average compositional formula (1), (CH3)aSi(OR1)b(OH)cO(4-a-b-c)/2 (1) wherein R1 is an organic group having 1 to 4 carbon atoms and a, b, and c are numbers satisfying the equations: 0.8≦a≦1.5, 0≦b≦0.3, 0.001≦c≦0.5, and 0.801≦a+b+c
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