公开(公告)号：US20060216520A1

公开(公告)日：2006-09-28

申请号：US11386949

申请日：2006-03-23

Applicant: Shoichi Osada

Inventor： Shoichi Osada

IPC: B32B27/38 ,  H01L21/56 ,  C08L63/00 ,  C08G59/00

CPC classification number: C08G59/688 ,  C08G59/4042 ,  C08G59/621 ,  H01L23/293 ,  H01L2924/0002 ,  Y10T428/31511 ,  H01L2924/00

Abstract: Epoxy resin compositions comprising (A) an epoxy resin, (C) an inorganic filler, (D) a cure accelerator in the form of an addition product of tertiary phosphine and benzoquinone, (E) a maleimide compound, and (F) an alkenyl phenol are effectively moldable and cures into products having a high Tg and a low dielectric constant and are best suited for the encapsulation of semiconductor devices.

Abstract translation: 环氧树脂组合物，其包含（A）环氧树脂，（C）无机填料，（D）以叔膦和苯醌的加成产物形式的固化促进剂，（E）马来酰亚胺化合物和（F） 苯酚有效地可模塑并固化成具有高Tg和低介电常数的产品，并且最适合于半导体器件的封装。

公开(公告)号：US07095125B2

公开(公告)日：2006-08-22

申请号：US10617827

申请日：2003-07-14

Applicant: Shoichi Osada ,  Eiichi Asano ,  Shigeki Ino ,  Takayuki Aoki ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

Inventor： Shoichi Osada ,  Eiichi Asano ,  Shigeki Ino ,  Takayuki Aoki ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

IPC: H01L23/29

CPC classification number: H01L23/293 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/12528 ,  Y10T428/31511 ,  C08L83/00 ,  H01L2924/00

Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.

公开(公告)号：US06894091B2

公开(公告)日：2005-05-17

申请号：US09883276

申请日：2001-06-19

Applicant: Shoichi Osada ,  Toshio Shiobara ,  Eiichi Asano ,  Kazutoshi Tomiyoshi ,  Takayuki Aoki ,  Shigeki Ino

Inventor： Shoichi Osada ,  Toshio Shiobara ,  Eiichi Asano ,  Kazutoshi Tomiyoshi ,  Takayuki Aoki ,  Shigeki Ino

IPC: C08K3/00 ,  C08G59/28 ,  C08G59/62 ,  C08K9/02 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31 ,  C08K5/00

CPC classification number: H01L23/293 ,  C08L63/00 ,  H01L2924/0002 ,  C08L61/04 ,  H01L2924/00

Abstract: A semiconductor encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, and (D) 300-900 parts by weight per 100 parts by weight of components (A) and (B) combined of an inorganic filler contains nitrogen atoms in an amount of 1.5-20% by weight based on the weight of components (A) and (B) combined. Cured parts of the composition exhibit high-temperature capabilities and flame retardance despite the absence of halogenated epoxy resins and antimony trioxide.

Abstract translation: 一种半导体封装环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）钼化合物和（D）每100重量份组分（A）300-900重量份， 和（B）组合的无机填料含有以组分（A）和（B）的重量计为1.5-20重量％的氮原子。 尽管没有卤化环氧树脂和三氧化锑，组合物的固化部分表现出高温能力和阻燃性。

公开(公告)号：US06221509B1

公开(公告)日：2001-04-24

申请号：US09291285

申请日：1999-04-14

Applicant: Tatsurou Hirano ,  Nobukazu Suzuki ,  Toshio Shiobara ,  Takayuki Aoki ,  Shoichi Osada

Inventor： Tatsurou Hirano ,  Nobukazu Suzuki ,  Toshio Shiobara ,  Takayuki Aoki ,  Shoichi Osada

IPC: H01L2912

CPC classification number: H01L23/295 ,  C08K3/34 ,  C08K7/18 ,  H01B3/40 ,  H01L2924/0002 ,  Y10T428/12528 ,  C08L63/00 ,  H01L2924/00

Abstract: In semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a curing agent and an inorganic filler, 1-90% by weight of the inorganic filler is spherical cristobalite. The compositions are able to achieve higher loadings of inorganic filler, allow easy control of the coefficient of thermal expansion, and provide high-quality cured products having improved thermal conductivity and low moisture absorption.

Abstract translation: 在包含环氧树脂，固化剂和无机填料的半导体封装环氧树脂组合物中，1-90重量％的无机填料是球形方英石。 组合物能够实现更高的无机填料负载，容易控制热膨胀系数，并提供具有改善的导热性和低吸湿性的高质量固化产物。

公开(公告)号：US5688430A

公开(公告)日：1997-11-18

申请号：US507519

申请日：1995-11-16

Applicant: Katsushige Matsuzaki ,  Tatsunori Sunagawa ,  Kenji Kawahito ,  Junji Omori ,  Yoshitaka Yamana ,  Shoichi Osada ,  Kiyoshi Aritome ,  Yoshimasa Ikeda ,  Izumi Matsushita ,  Wataru Ohashi ,  Kaoru Ito ,  Fumihiko Hasegawa ,  Shinya Nariki ,  Michimasa Sasaki ,  Noritane Tsugane ,  Toshiaki Kurihara

Inventor： Katsushige Matsuzaki ,  Tatsunori Sunagawa ,  Kenji Kawahito ,  Junji Omori ,  Yoshitaka Yamana ,  Shoichi Osada ,  Kiyoshi Aritome ,  Yoshimasa Ikeda ,  Izumi Matsushita ,  Wataru Ohashi ,  Kaoru Ito ,  Fumihiko Hasegawa ,  Shinya Nariki ,  Michimasa Sasaki ,  Noritane Tsugane ,  Toshiaki Kurihara

IPC: C01G49/00 ,  C04B35/26 ,  C04B35/626 ,  H01F1/34 ,  C04B35/36 ,  C04B35/38 ,  C04B35/40 ,  C04B35/46

CPC classification number: C04B35/2658 ,  C01G49/009 ,  C04B35/26 ,  C04B35/626 ,  H01F1/344 ,  C01P2004/61 ,  C01P2006/12

Abstract: This invention provides an atomization roasting method which can easily obtain a soft ferrite sintered body, for example, a sintered body having a crystal particle size of not greater than 2 .mu.m, by using as a raw material an ultra-fine powder having a mean particle size of not greater than 0.1 .mu.m obtained by atomization roasting and which can obtain a soft ferrite raw material powder subjected to an oxidation reaction, having an extremely small residual chlorine content, and having and extremely small deviation of high vapor pressure components such as zinc between the atomized raw material solution and the oxide as the product and which can economically produce a soft ferrite core having an excellent power loss characteristic in a high frequency range, particularly in a MHz range, and is extremely effective for reducing the size of a high frequency transformer. In the production method of the soft ferrite raw material powder, the deviation of the recovered powder becomes extremely small and residual hydrogen chloride and chlorides can be reduced. Therefore, loads to the component adjustment step after roasting and to the Cl removing step can be reduced and process steps can be eliminated. Accordingly, the present invention can drastically reduce the cost of production and can improve quality.

Abstract translation: PCT No.PCT / JP93 / 00222 Sec。 371日期：1995年11月16日 102（e）日期1995年11月16日PCT提交1993年2月23日PCT公布。 WO94 / 19283 PCT出版物 日本1994年1月9日本发明提供一种雾化焙烧方法，其可以容易地获得软质铁氧体烧结体，例如具有不大于2μm的结晶粒径的烧结体， 通过雾化焙烧获得的平均粒径不大于0.1μm的细粉末，其可以获得具有极小残留氯含量的氧化反应的软质铁氧体原料粉末，并且具有极小的偏差 雾化原料溶液和氧化物之间的蒸汽压成分如锌，作为产品，可以经济地生产出在高频范围内，特别是在MHz范围内具有优异的功率损耗特性的软铁氧体磁芯，对于 降低高频变压器的尺寸。 在软铁氧体原料粉末的制造方法中，回收粉末的偏差变得非常小，残留的氯化氢和氯化物可以减少。 因此，可以减少焙烧后的组分调整步骤和Cl去除步骤的负载，并且可以消除处理步骤。 因此，本发明能够大幅度降低生产成本，提高质量。

公开(公告)号：US07999016B2

公开(公告)日：2011-08-16

申请号：US11193351

申请日：2005-08-01

Applicant: Shoichi Osada ,  Eiji Nakayama

Inventor： Shoichi Osada ,  Eiji Nakayama

IPC: C08K5/00 ,  H01L21/00

CPC classification number: H01L23/295 ,  C08K3/013 ,  C08K3/22 ,  C08K5/5399 ,  C08L61/04 ,  C08L63/00 ,  C08L85/02 ,  H01L23/293 ,  H01L2924/0002 ,  Y10T428/31511 ,  C08L2666/16 ,  H01L2924/00

Abstract: Epoxy resin compositions comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, (D) a rare earth oxide, and optionally (E) a phosphazene compound cure into products having improved heat resistance and moisture-proof reliability and are best suited for the encapsulation of semiconductor devices.

Abstract translation: 环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）无机填料，（D）稀土氧化物和任选的（E）磷腈化合物固化成具有改善的耐热性的产物 和防潮可靠性，最适合于半导体器件的封装。

公开(公告)号：US20100081748A1

公开(公告)日：2010-04-01

申请号：US12569433

申请日：2009-09-29

Applicant: Yusuke TAGUCHI ,  Junichi Sawada ,  Kenji Hagiwara ,  Shoichi Osada ,  Kazutoshi Tomiyoshi

Inventor： Yusuke TAGUCHI ,  Junichi Sawada ,  Kenji Hagiwara ,  Shoichi Osada ,  Kazutoshi Tomiyoshi

IPC: C08K3/22 ,  C08L83/04

CPC classification number: H01L23/296 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08K3/22 ,  C08L83/04 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12044 ,  C08L83/00 ,  H01L2924/00014

Abstract: The present invention provides a silicone resin composition for an optical semiconductor device, comprising(A) 100 parts by mass of an organopolysiloxane having a weight average molecular weight of from 500 to 20000, reduced to polystyrene, and represented by the following average compositional formula (1), (CH3)aSi(OR1)b(OH)cO(4-a-b-c)/2  (1) wherein R1 is an organic group having 1 to 4 carbon atoms and a, b, and c are numbers satisfying the equations: 0.8≦a≦1.5, 0≦b≦0.3, 0.001≦c≦0.5, and 0.801≦a+b+c

Abstract translation: 本发明提供一种光半导体装置用有机硅树脂组合物，其包含：（A）100质量份的重均分子量为500〜20000的有机聚硅氧烷，还原为聚苯乙烯，由下列平均组成式（ 1），（CH3）aSi（OR1）b（OH）cO（4-abc）/ 2（1）其中R1是具有1至4个碳原子的有机基团，a，b和c是满足下列等式的数字： 0.8和nlE; a＆nlE; 1.5,0.001和nlE; c＆nlE; 0.5和0.801≤n1E; a + b + c2，（B）3到200质量份白色颜料，（C）400 1000质量份除了所述白色颜料以外的无机填充材料，（D）0.01〜10质量份的缩合催化剂，（E）2〜50质量份的由有机聚硅氧烷构成的有机聚硅氧烷，所述直链二有机聚硅氧烷部分由 下式（2），其中R 2和R 3彼此独立地是选自羟基，烷基 具有1至3个碳原子的基团，环己基，乙烯基，苯基和烯丙基，其中m为5-50的整数。

公开(公告)号：US07511383B2

公开(公告)日：2009-03-31

申请号：US11395216

申请日：2006-04-03

Applicant: Shoichi Osada

Inventor： Shoichi Osada

IPC: H01L23/29 ,  C09K21/04 ,  C09K21/10 ,  C09K21/12 ,  B32B5/16 ,  C08L63/00 ,  B32B27/38

CPC classification number: C08L63/00 ,  C08G59/621 ,  C08K3/016 ,  C08K5/5399 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2998

Abstract: A flame retardant featuring: an inorganic porous fine particle, a phosphazene compound represented by the following average compositional formula (1) (X is a single bond, CH2, C(CH3)2, SO2, S, 0, or O(CO)O; n is an integer of from 3 to 1000; d and e are numbers with 2d+e=2n), and a resin layer. The phosphazene compound is supported on the inorganic porous fine particle, and the resin layer coats the inorganic porous fine particle with the phosphazene compound supported thereon. The resin layer thermally decomposes to lose weight by 10% at a temperature of from 300° C. to 500° C., as measured by thermogravimetry in the air at a heating rate of 10° C./min.

Abstract translation: 阻燃剂，其特征在于：无机多孔微粒，由以下平均组成式（1）表示的磷腈化合物（X为单键，CH 2，C（CH 3）2，SO 2，S，O或O（CO） O; n为3〜1000的整数; d和e为2d + e = 2n的数）和树脂层。 磷腈化合物负载在无机多孔微粒上，树脂层涂覆无机多孔微粒与载于其上的磷腈化合物。 树脂层在300℃〜500℃的温度下热分解10％，以10℃/分钟的升温速度通过空气中的热重分析法测定。

公开(公告)号：US20080083995A1

公开(公告)日：2008-04-10

申请号：US11866780

申请日：2007-10-03

Applicant: Shoichi OSADA

Inventor： Shoichi OSADA

IPC: H01L23/29 ,  C08L63/00

CPC classification number: C08G59/688 ,  C08G59/4042 ,  C08G59/621 ,  H01L23/293 ,  H01L23/295 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An epoxy resin composition for encapsulating a semiconductor device is provided. This composition contains the following components (A), (C), (D), (E), (F) and (G) as critical components: (A) an epoxy resin; (C) an inorganic filler; (D) a curing accelerator of the general formula (1): (E) a radical initiator; (F) a compound having at least two maleimide group per molecule; and (G) a phenol compound having at least one alkenyl group per molecule.

Abstract translation: 提供一种用于封装半导体器件的环氧树脂组合物。 该组合物包含以下组分（A），（C），（D），（E），（F）和（G））作为关键组分：（A）环氧树脂; （C）无机填料; （D）通式（1）的固化促进剂：（E）自由基引发剂; （F）每分子具有至少两个马来酰亚胺基团的化合物; 和（G）每分子具有至少一个烯基的酚化合物。

公开(公告)号：US06783859B2

公开(公告)日：2004-08-31

申请号：US10358188

申请日：2003-02-05

Applicant: Shoichi Osada ,  Shingo Ando ,  Hiroyuki Takenaka ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

Inventor： Shoichi Osada ,  Shingo Ando ,  Hiroyuki Takenaka ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara

IPC: B32B2738

CPC classification number: C08G59/621 ,  C08K3/04 ,  C08K3/10 ,  C08K3/36 ,  C08K5/5399 ,  C08K5/5419 ,  H01L23/293 ,  H01L2924/0002 ,  Y10T428/31511 ,  H01L2924/00

Abstract: An epoxy resin composition comprising an epoxy resin, a phenolic resin curing agent, an inorganic filler, zinc molybdate on an inorganic support, and a complementary combination of two phosphazene compounds is effectively moldable, flame retardant and suitable for semiconductor encapsulation. A semiconductor device encapsulated with the cured epoxy resin composition is improved in flame retardance and moisture-proof reliability.

Abstract translation: 包含环氧树脂，酚醛树脂固化剂，无机填料，无机载体上的钼酸锌和两种磷腈化合物的互补组合的环氧树脂组合物是有效的可模塑的，阻燃的并且适用于半导体封装。 用固化的环氧树脂组合物封装的半导体器件的阻燃性和防潮可靠性得到改善。