Invention Grant
US08022311B2 Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same 有权
用于提高嵌入式电容器容差的印刷电路板及其制造方法

Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same
Abstract:
Disclosed are a printed circuit board for improving the tolerance of embedded capacitors and a method of manufacturing the same. The printed circuit board having embedded capacitors is manufactured by transferring and embedding a circuit layer having a lower electrode formed through an additive process into a resin insulating layer, and thereby is minimized in the circuit tolerance conventionally caused by an etching process to thus be applied to capacitors for RF matching.
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