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    METHOD OF MANUFACTURING MULTI-BAND FRONT END MODULE
    1.
    发明申请
    METHOD OF MANUFACTURING MULTI-BAND FRONT END MODULE 审中-公开
    制造多带前端模块的方法

    公开(公告)号：US20120198693A1

    公开(公告)日：2012-08-09

    申请号：US13448692

    申请日：2012-04-17

    申请人： Kyung-O KIM ,  Tae-Eui Kim

    发明人： Kyung-O KIM ,  Tae-Eui Kim

    IPC分类号： H05K3/10

    CPC分类号： H01G4/30 ,  H01G4/40 ,  H01L23/3121 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/15192 ,  H05K1/162 ,  H05K1/165 ,  H05K3/205 ,  H05K3/4644 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/09672 ,  Y10T29/49155

    摘要： A method of manufacturing a multi-band front end module having an embedded passive element, the method including: preparing metal plates formed on either surface of an adhesion layer interposed therebetween; forming first circuit patterns on the plates; separating the plates by removing the adhesion layer; pressing one of the plates to one surface of an insulation layer and another of the plates to the other surface of the insulation layer; removing the plates to form the insulation layer having the first circuit patterns formed on either surface thereof; stacking dielectric layers on either surface of the insulation layer; and forming a second circuit pattern on the dielectric layers stacked on the either surface of the insulation layer.

    摘要翻译： 一种制造具有嵌入式无源元件的多频带前端模块的方法，所述方法包括：制备形成在其间的粘合层的任一表面上的金属板; 在板上形成第一电路图案; 通过去除粘合层来分离板; 将一个板压在绝缘层的一个表面上，将另一个板压到绝缘层的另一个表面; 去除所述板以形成具有形成在其任一表面上的第一电路图案的绝缘层; 在绝缘层的任一表面上堆叠电介质层; 以及在层叠在绝缘层的任一表面上的电介质层上形成第二电路图案。

    Method of manufacturing printed circuit board having embedded resistors
    3.
    发明授权
    Method of manufacturing printed circuit board having embedded resistors 失效
    具有嵌入式电阻器的印刷电路板的制造方法

    公开(公告)号：US08166653B2

    公开(公告)日：2012-05-01

    申请号：US12801870

    申请日：2010-06-29

    申请人： Hwa Sun Park ,  Tae Eui Kim

    发明人： Hwa Sun Park ,  Tae Eui Kim

    IPC分类号： H01K3/10

    CPC分类号： H05K1/167 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4644 ,  H05K2201/09481 ,  Y10T29/435 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

    摘要： A method of manufacturing a printed circuit board (PCB) having embedded resistors, including providing a PCB on which internal layer circuit patterns, including electrode pads, are formed; layering insulating layers on the PCB; forming first via holes on the electrode pads and simultaneously forming second via holes at predetermined locations on the internal layer circuit patterns; forming contact pads for connecting the electrode pads with resistors by filling the first via holes with oxidation-resistant conductive material and flattening the oxidation-resistant conductive material; forming the resistors so that ends of each resistor are connected to two respective contact pads, which are spaced apart from each other; forming circuit patterns on the PCB, in which the second via holes are formed; and layering insulting layers on the PCB having the formed circuit patterns, and forming external layer circuit patterns.

    摘要翻译： 一种具有嵌入式电阻器的印刷电路板（PCB）的制造方法，其特征在于，提供形成有包含电极焊盘的内层电路图案的PCB; 在PCB上分层绝缘层; 在电极焊盘上形成第一通孔并同时在内层电路图形上的预定位置形成第二通孔; 形成用于通过用耐氧化导电材料填充第一通孔并使抗氧化导电材料变平的方式将电极焊盘与电阻器连接的接触焊盘; 形成电阻器，使得每个电阻器的端部连接到彼此间隔开的两个相应的接触焊盘; 在PCB上形成电路图案，其中形成第二通孔; 以及在PCB上具有形成的电路图案的层叠绝缘层，以及形成外部层电路图案。

    Method of manufacturing printed circuit board having embedded resistors
    6.
    发明申请
    Method of manufacturing printed circuit board having embedded resistors 失效
    具有嵌入式电阻器的印刷电路板的制造方法

    公开(公告)号：US20100269335A1

    公开(公告)日：2010-10-28

    申请号：US12801870

    申请日：2010-06-29

    申请人： Hwa Sun Park ,  Tae Eui Kim

    发明人： Hwa Sun Park ,  Tae Eui Kim

    IPC分类号： H05K3/10

    CPC分类号： H05K1/167 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4644 ,  H05K2201/09481 ,  Y10T29/435 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

    摘要： A method of manufacturing a printed circuit board (PCB) having embedded resistors, including providing a PCB on which internal layer circuit patterns, including electrode pads, are formed; layering insulating layers on the PCB; forming first via holes on the electrode pads and simultaneously forming second via holes at predetermined locations on the internal layer circuit patterns; forming contact pads for connecting the electrode pads with resistors by filling the first via holes with oxidation-resistant conductive material and flattening the oxidation-resistant conductive material; forming the resistors so that ends of each resistor are connected to two respective contact pads, which are spaced apart from each other; forming circuit patterns on the PCB, in which the second via holes are formed; and layering insulting layers on the PCB having the formed circuit patterns, and forming external layer circuit patterns.

    摘要翻译： 一种具有嵌入式电阻器的印刷电路板（PCB）的制造方法，其特征在于，提供形成有包含电极焊盘的内层电路图案的PCB; 在PCB上分层绝缘层; 在电极焊盘上形成第一通孔并同时在内层电路图形上的预定位置形成第二通孔; 形成用于通过用耐氧化导电材料填充第一通孔并使抗氧化导电材料变平的方式将电极焊盘与电阻器连接的接触焊盘; 形成电阻器，使得每个电阻器的端部连接到彼此间隔开的两个相应的接触焊盘; 在PCB上形成电路图案，其中形成第二通孔; 以及在PCB上具有形成的电路图案的层叠绝缘层，以及形成外部层电路图案。

    Multi-band front end module
    7.
    发明申请
    Multi-band front end module 审中-公开
    多频段前端模块

    公开(公告)号：US20090161294A1

    公开(公告)日：2009-06-25

    申请号：US12213702

    申请日：2008-06-23

    申请人： Kyung-O Kim ,  Tae-Eui Kim

    发明人： Kyung-O Kim ,  Tae-Eui Kim

    IPC分类号： H01G4/06 ,  H01G9/00

    CPC分类号： H01G4/30 ,  H01G4/40 ,  H01L23/3121 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/15192 ,  H05K1/162 ,  H05K1/165 ,  H05K3/205 ,  H05K3/4644 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/09672 ,  Y10T29/49155

    摘要： A multi-band front end module and a method of manufacturing the multi-band front end module. The method may include forming a first circuit pattern on one side of an insulation layer, stacking a dielectric layer over the one side of the insulation layer, and forming a second circuit pattern on the dielectric layer in correspondence with the first circuit pattern such that at least one of a capacitor and an inductor is implemented. An embodiment of the invention allows the positioning of various passive elements while maintaining a compact size for the multi-band front end module.

    摘要翻译： 一种多频带前端模块及其制造方法。 该方法可以包括在绝缘层的一侧上形成第一电路图案，在绝缘层的一侧层叠电介质层，并且在电介质层上形成与第一电路图案对应的第二电路图案，使得在 实现了电容器和电感器中的至少一个。 本发明的实施例允许各种无源元件的定位，同时保持用于多频带前端模块的紧凑的尺寸。