Invention Grant
- Patent Title: Electronic device assembly
- Patent Title (中): 电子设备组装
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Application No.: US12205551Application Date: 2008-09-05
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Publication No.: US08023261B2Publication Date: 2011-09-20
- Inventor: Emery Sanford , Stephen Brian Lynch , Anthony Sagala Montevirgen , Fletcher Rothkopf , Mathias Schmidt , Hamid Mohammadinia , R. Sean Murphy
- Applicant: Emery Sanford , Stephen Brian Lynch , Anthony Sagala Montevirgen , Fletcher Rothkopf , Mathias Schmidt , Hamid Mohammadinia , R. Sean Murphy
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kramer Levin Naftalis & Frankel LLP
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H04M1/00

Abstract:
Apparatus and methods for assembling an electronic device and components thereof are provided. The electronic device may include a housing and a cover inserted into an opening in the housing. The electronic device may also include a first assembly that may be inserted into the housing through a first end, and a second assembly that may be inserted into the housing through a second end. The electronic device may also include end cap assemblies. In some embodiments, the electronic device may include an input mechanism coupled to the housing and a plate coupled to the housing. In some embodiments, a connector of the electronic device may be mounted on a circuit board by inserting a fixture into the connector, mounting the connector to a portion of the circuit board, removing the fixture from the connector, and separating the portion of the circuit board from another portion of the circuit board.
Public/Granted literature
- US20100061039A1 ELECTRONIC DEVICE ASSEMBLY Public/Granted day:2010-03-11
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