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    Electrical connector assembly including hoops and hooks
    2.
    发明授权
    Electrical connector assembly including hoops and hooks 有权
    电连接器组件，包括箍和钩

    公开(公告)号：US08814575B2

    公开(公告)日：2014-08-26

    申请号：US12715685

    申请日：2010-03-02

    申请人： Stephen Brian Lynch ,  Fletcher Rothkopf

    发明人： Stephen Brian Lynch ,  Fletcher Rothkopf

    IPC分类号： H01R12/00

    CPC分类号： B23P17/00 ,  H01R12/00

    摘要： Apparatus, systems and methods for forming a connector assembly that includes hoops and hooks designed to engage each other are disclosed. According to one aspect, a connector assembly includes a first substrate and a second substrate. The first substrate includes a plurality of hooks arranged in a hook area. The hooks include at least one hook that is arranged to form an electrical contact. The second substrate includes a plurality of hoops arranged in a hoop area. The hoops include at least one hoop that is arranged to form the electrical contact. The hook interfaces with the hoop to form the electrical contact.

    摘要翻译： 公开了用于形成连接器组件的装置，系统和方法，其包括被设计成彼此接合的箍和钩。 根据一个方面，连接器组件包括第一基板和第二基板。 第一基板包括布置在钩区域中的多个钩。 钩子包括布置成形成电接触件的至少一个钩子。 第二基板包括布置在箍区域中的多个箍。 环包括至少一个环，其布置成形成电接触。 钩子与箍形成电接触。

    Assembly techniques for electronic devices having compact housing
    6.
    发明授权
    Assembly techniques for electronic devices having compact housing 有权
    具有紧凑外壳的电子设备的装配技术

    公开(公告)号：US08522425B2

    公开(公告)日：2013-09-03

    申请号：US12240494

    申请日：2008-09-29

    申请人： Stephen Brian Lynch

    发明人： Stephen Brian Lynch

    IPC分类号： H05K3/34 ,  H05K3/20 ,  H05K3/30

    CPC分类号： H05K3/3405 ,  B23K1/0016 ,  B23K1/002 ,  B23K3/047 ,  B23K2101/38 ,  H05K1/182 ,  H05K3/3494 ,  H05K2201/10189 ,  H05K2203/0195 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/534

    摘要： A method for assembling an electronic device comprises inserting a thermal element into an electrical connector contained within a special volume defined by a constricted enclosure that comprises a housing of the electronic device. The spatial volume contains a printed circuit board and the electrical connector includes internal electrical contacts that are positioned proximate to solder connection pads on the printed circuit board when the electrical connector and the printed circuit board are contained within the constricted enclosure. Insertion of the thermal element heats the internal electrical contacts so that solder on the solder connection pads reflows to form solder connections respectively between the internal electrical contacts and the solder connection pads. Thereafter, the thermal element is removed from the electrical contact.

    摘要翻译： 一种用于组装电子设备的方法包括将热元件插入包含在由包括电子设备的壳体的收缩壳体限定的特殊体积内的电连接器中。 空间体积包含印刷电路板，并且电连接器包括当电连接器和印刷电路板被包含在收缩的外壳内时位于印刷电路板上的焊接连接焊盘附近的内部电触头。 热元件的插入加热内部电触头，使得焊料连接焊盘上的焊料回流以分别在内部电触点和焊料连接焊盘之间形成焊接连接​​。 此后，将热元件从电接触件移除。

    Clickable and tactile buttons for a touch surface
    7.
    发明授权
    Clickable and tactile buttons for a touch surface 有权
    用于触摸表面的可点击和触觉按钮

    公开(公告)号：US08462133B2

    公开(公告)日：2013-06-11

    申请号：US12240559

    申请日：2008-09-29

    申请人： Stephen Brian Lynch ,  John Benjamin Filson ,  Fletcher R. Rothkopf

    发明人： Stephen Brian Lynch ,  John Benjamin Filson ,  Fletcher R. Rothkopf

    IPC分类号： G06F3/045 ,  G06F3/041

    CPC分类号： G06F3/0202 ,  G06F3/0205 ,  G06F3/044 ,  G06F3/04886 ,  H03K17/962 ,  H03K2217/96062

    摘要： Methods and apparatus for provide physical buttons for use on a touch surface are disclosed. According to one aspect of the present invention, an apparatus includes a display arrangement and a first button attachment structure. The display arrangement includes a first surface which has a first touch-sensitive area. The first touch-sensitive area is capable of sensing touch. The first button attachment structure includes a first attachment area and a first button actuation area. The first attachment area is mounted on the first surface such that the first button actuation is aligned at least partially over the first touch-sensitive area. The first button actuation area is arranged to deform when a force is applied to the first button actuation area to engage the first touch-sensitive area.

    摘要翻译： 公开了用于提供在触摸表面上使用的物理按钮的方法和装置。 根据本发明的一个方面，一种装置包括显示装置和第一按钮附接结构。 显示装置包括具有第一触敏区域的第一表面。 第一个触敏区域能够感应触摸。 第一按钮附接结构包括第一附接区域和第一按钮致动区域。 第一附接区域安装在第一表面上，使得第一按钮致动至少部分地对准第一触敏区域。 第一按钮致动区域布置成当力施加到第一按钮致动区域以接合第一触敏区域时变形。

    INTEGRATED THERMAL SPREADING
    8.
    发明申请
    INTEGRATED THERMAL SPREADING 有权
    一体化热膨胀

    公开(公告)号：US20130082908A1

    公开(公告)日：2013-04-04

    申请号：US13251108

    申请日：2011-09-30

    申请人： Stephen Brian Lynch ,  Fletcher R. Rothkopf ,  Scott Andrew Myers

    发明人： Stephen Brian Lynch ,  Fletcher R. Rothkopf ,  Scott Andrew Myers

    IPC分类号： G09G3/30 ,  H05K13/00

    CPC分类号： H01L51/529 ,  G06F1/203 ,  Y10T29/49002

    摘要： Techniques are provided for removing thermal gradients from an organic light emitting diode (OLED) display. In one embodiment, an OLED display device includes a thermally conductive layer placed between electronic components housed within the device and the OLED display. Heat given off by the electronic components is transferred from warm to cold regions of the thermally conductive layer to create a more uniform ambient temperature across the back of the OLED display. Some embodiments indicate a position of the thermally conductive layer within layers of an OLED display stack (e.g., between a glass substrate and polyimide layer). Some embodiments include a specific range of thermal conductivities and/or thicknesses desired for the thermally conductive layer.

    摘要翻译： 提供了用于从有机发光二极管（OLED）显示器去除热梯度的技术。 在一个实施例中，OLED显示装置包括放置在容纳在装置内的电子部件和OLED显示器之间的导热层。 由电子部件发出的热量从导热层的温暖区域转移，从而在OLED显示器背面产生更均匀的环境温度。 一些实施例表示导热层位于OLED显示堆叠层（例如玻璃基板和聚酰亚胺层之间）的位置。 一些实施例包括导热层所需的特定范围的热导率和/或厚度。

    Contactless plug detect mechanism
    9.
    发明授权
    Contactless plug detect mechanism 有权
    非接触式插头检测机构

    公开(公告)号：US08360801B2

    公开(公告)日：2013-01-29

    申请号：US12356567

    申请日：2009-01-21

    申请人： Stephen Brian Lynch ,  Fletcher Rothkopf ,  Gordon Cameron

    发明人： Stephen Brian Lynch ,  Fletcher Rothkopf ,  Gordon Cameron

    IPC分类号： H01R3/00

    CPC分类号： H01R13/641 ,  H01R24/58 ,  H01R2107/00

    摘要： This is directed to systems and methods for detecting the insertion of a plug in a device port without physically contacting the plug. For example, systems and methods are provided for detecting the insertion of an audio plug into an audio jack without using physical contacts placed in the periphery of the audio jack. In some embodiments, an electrically conductive element (e.g., a circuit board trace) can be provided on a surface of the port or within the port wall. When a metallic or conductive plug is inserted into the port, the plug can interact with the conductive element and cause a change in capacitance or induction detected by appropriate circuitry coupled to the conductive element. In some embodiments, an optical sensor can be used to detect a plug placed in a port. In some embodiments, the electronic device can detect distinguishable attributes associated with the contact between the electrical contact of plug and port contacts using an appropriate sensor (e.g., a microphone or an accelerometer).

    摘要翻译： 这涉及用于检测插头插入设备端口而不物理接触插头的系统和方法。 例如，提供了用于检测音频插头插入到音频插孔中而不使用放置在音频插孔周边的物理触点的系统和方法。 在一些实施例中，导电元件（例如，电路板迹线）可以设置在端口的表面或端口壁内。 当金属或导电插头插入端口时，插头可以与导电元件相互作用，并引起电容变化或通过耦合到导电元件的适当电路检测到的感应。 在一些实施例中，可以使用光学传感器来检测放置在端口中的插头。 在一些实施例中，电子设备可以使用适当的传感器（例如，麦克风或加速度计）来检测与插头和端口触点的电触点之间的接触相关联的可区分属性。