Invention Grant
- Patent Title: Multi-dielectric material circuit board supporting high-speed and low-speed signaling
- Patent Title (中): 多介质材料电路板支持高速和低速信号
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Application No.: US11978808Application Date: 2007-10-30
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Publication No.: US08026450B2Publication Date: 2011-09-27
- Inventor: Joel R. Goergen
- Applicant: Joel R. Goergen
- Applicant Address: US CA San Jose
- Assignee: Force 10 Networks, Inc.
- Current Assignee: Force 10 Networks, Inc.
- Current Assignee Address: US CA San Jose
- Agent Robert Schuler
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
A circuit board comprises a center segment distributing power and low-speed signaling, and outer segments for high-speed signaling. The segments use dielectric materials with different dielectric constants, with the outer segments supporting higher-speed signal transmission.
Public/Granted literature
- US20080066951A1 Multi-Dielectric material circuit board supporting high-speed and low-speed signaling Public/Granted day:2008-03-20
Information query
