发明授权
US08026593B2 Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof
有权
具有用于焊盘的保护导电层的集成电路封装系统及其制造方法
- 专利标题: Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof
- 专利标题(中): 具有用于焊盘的保护导电层的集成电路封装系统及其制造方法
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申请号: US11694907申请日: 2007-03-30
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公开(公告)号: US08026593B2公开(公告)日: 2011-09-27
- 发明人: Yaojian Lin , Haijing Cao , Qing Zhang
- 申请人: Yaojian Lin , Haijing Cao , Qing Zhang
- 申请人地址: SG Singapore
- 专利权人: Stats Chippac Ltd.
- 当前专利权人: Stats Chippac Ltd.
- 当前专利权人地址: SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号: H01L23/12
- IPC分类号: H01L23/12
摘要:
An integrated circuit package system is provided including providing an integrated circuit die having a contact pad, forming a protection cover over the contact pad, forming a passivation layer having a first opening over the protection cover with the first opening exposing the protection cover, developing a conductive layer over the passivation layer, and forming a pad opening in the protection cover for exposing the contact pad.
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