发明授权
US08026593B2 Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof 有权
具有用于焊盘的保护导电层的集成电路封装系统及其制造方法

  • 专利标题: Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof
  • 专利标题(中): 具有用于焊盘的保护导电层的集成电路封装系统及其制造方法
  • 申请号: US11694907
    申请日: 2007-03-30
  • 公开(公告)号: US08026593B2
    公开(公告)日: 2011-09-27
  • 发明人: Yaojian LinHaijing CaoQing Zhang
  • 申请人: Yaojian LinHaijing CaoQing Zhang
  • 申请人地址: SG Singapore
  • 专利权人: Stats Chippac Ltd.
  • 当前专利权人: Stats Chippac Ltd.
  • 当前专利权人地址: SG Singapore
  • 代理商 Mikio Ishimaru
  • 主分类号: H01L23/12
  • IPC分类号: H01L23/12
Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof
摘要:
An integrated circuit package system is provided including providing an integrated circuit die having a contact pad, forming a protection cover over the contact pad, forming a passivation layer having a first opening over the protection cover with the first opening exposing the protection cover, developing a conductive layer over the passivation layer, and forming a pad opening in the protection cover for exposing the contact pad.
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