发明授权
- 专利标题： Heat-conductive resin composition and plastic article including the same
- 专利标题（中）： 导热性树脂组合物和包含其的塑料制品
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申请号： US12491383申请日： 2009-06-25
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公开(公告)号： US08029876B2公开(公告)日： 2011-10-04
- 发明人: Sun Ho Park , Chang Min Hong
- 申请人： Sun Ho Park , Chang Min Hong
- 申请人地址： KR Gumi-si
- 专利权人： Cheil Industries Inc.
- 当前专利权人： Cheil Industries Inc.
- 当前专利权人地址： KR Gumi-si
- 代理机构： Summa, Additon & Ashe, P.A.
- 优先权： KR10-2006-0134980 20061227
- 主分类号： C08L101/12
- IPC分类号： C08L101/12
摘要：
A thermal-conductive resin composition and a plastic article are provided. The thermal-conductive resin composition comprises about 30 to about 60% by weight of a thermoplastic resin and about 40 to about 70% by weight of a thermal-conductive filler comprising about 10% by weight or more of a thermal-conductive filler with a height-to-length ratio (length/height) of about 7,000 to about 40,000 and about 10% by weight or more of a thermal-conductive filler with a height-to-length ratio of about 10 to about 1,000.
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