An interconnect assembly for interconnecting first and second electrical components includes a substrate having opposed first and second surfaces and a first array of contacts on the first surface for engaging corresponding elements on the first electrical component. The first array of contacts defines a compressible interface that mates with the first electrical component. The first array of contacts includes signal contacts transferring data signals across the compressible interface and the first array of contacts includes a combination of power contacts that jointly convey power across the compressible interface. The interconnect assembly also includes a second array of contacts on the second surface for engaging corresponding elements on the second electrical component. The second array of contacts having signal contacts electrically connected to the signal contact of the first array of contacts and power contacts electrically connected to the power contacts of the second array of contacts.