发明授权
- 专利标题: Semiconductor device
- 专利标题(中): 半导体器件
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申请号: US12110966申请日: 2008-04-28
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公开(公告)号: US08035158B2公开(公告)日: 2011-10-11
- 发明人: Yoshinao Miura , Hitoshi Ninomiya
- 申请人: Yoshinao Miura , Hitoshi Ninomiya
- 申请人地址: JP Kanagawa
- 专利权人: Renesas Electronics Corporation
- 当前专利权人: Renesas Electronics Corporation
- 当前专利权人地址: JP Kanagawa
- 代理机构: Young & Thompson
- 优先权: JP2005-258747 20050907; JP2006-122976 20060427
- 主分类号: H01L29/66
- IPC分类号: H01L29/66
摘要:
Aiming at realizing high breakdown voltage and low ON resistance of a semiconductor device having the super-junction structure, the semiconductor device of the present invention has a semiconductor substrate having an element forming region having a gate electrode formed therein, and a periphery region formed around the element forming region, and having an field oxide film formed therein; and a parallel p-n layer having n-type drift regions and p-type column regions alternately arranged therein, formed along the main surface of the semiconductor substrate, as being distributed over the element forming region and a part of the periphery region, wherein the periphery region has no column region formed beneath the end portion on the element forming region side of the field oxide film and has p-type column regions as at least one column region formed under the field oxide film.
公开/授权文献
- US20080298291A1 SEMICONDUCTOR DEVICE 公开/授权日:2008-12-04
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