发明授权
- 专利标题： Printed wiring board with built-in semiconductor element, and process for producing the same
- 专利标题（中）： 具有内置半导体元件的印刷电路板及其制造方法
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申请号： US12966251申请日： 2010-12-13
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公开(公告)号： US08035979B2公开(公告)日： 2011-10-11
- 发明人: Yutaka Yoshino , Takahiro Shirai , Shinji Kadono , Mineo Kawamoto , Minoru Enomoto , Masakatsu Goto , Makoto Araki , Naoki Toda
- 申请人： Yutaka Yoshino , Takahiro Shirai , Shinji Kadono , Mineo Kawamoto , Minoru Enomoto , Masakatsu Goto , Makoto Araki , Naoki Toda
- 申请人地址： JP Tokyo JP Tokyo
- 专利权人： CMK Corporation,Renesas Eastern Japan Semiconductor, Inc.
- 当前专利权人： CMK Corporation,Renesas Eastern Japan Semiconductor, Inc.
- 当前专利权人地址： JP Tokyo JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2006-005582 20060113; JP2006-280930 20061016
- 主分类号： H05K1/18
- IPC分类号： H05K1/18
摘要：
A printed wiring board includes a built-in semiconductor element. A protective film is formed on a semiconductor element-mounted surface of a base substrate to which the built-in semiconductor element is connected to protect the semiconductor element-mounted surface excepting a mounting pad. Upper and side surfaces of the built-in semiconductor element are covered with a first insulating film formed by filling a sealing material. The first insulating film is covered with a second insulating film formed of an insulating resin melted from an insulating layer that is provided in side and upper portions of the built-in semiconductor element.
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