公开(公告)号：US08029255B2

公开(公告)日：2011-10-04

申请号：US11266279

申请日：2005-11-04

申请人： Naoya Morozumi ,  Yasuhiro Sakakibara ,  Makoto Araki ,  Hiroki Tomoda ,  Toshihiko Fukuda

发明人： Naoya Morozumi ,  Yasuhiro Sakakibara ,  Makoto Araki ,  Hiroki Tomoda ,  Toshihiko Fukuda

IPC分类号： F04C18/02 ,  F04C2/00

CPC分类号： F04C23/008 ,  F04C18/0215 ,  F04C29/02

摘要： It provides at a low price a compressor capable of preventing a waste oil pipe from falling off and curbing leakage of lubricating oil and oscillation of the pipe. An L-shaped waste oil pipe 8 for returning lubricating oil 20 to a bottom of a motor chamber 22 is connected to a waste oil passage 33 of a main frame 3 so as to put at least a part of the waste oil pipe 8 in elastic contact with an internal surface of an airtight container 2.

摘要翻译： 它以低价格提供了能够防止废油管脱落并且抑制润滑油泄漏和管道振荡的压缩机。 用于将润滑油20返回到电动机室22的底部的L形废油管8连接到主框架3的废油通道33，以使废油管8的至少一部分具有弹性 与气密容器2的内表面接触。

公开(公告)号：US07136825B2

公开(公告)日：2006-11-14

申请号：US09753728

申请日：2001-01-03

申请人： Makoto Araki ,  Atsushi Okada ,  Takashi Hirashima ,  Takashi Fukuda

发明人： Makoto Araki ,  Atsushi Okada ,  Takashi Hirashima ,  Takashi Fukuda

IPC分类号： G06Q99/00

CPC分类号： G06Q10/10 ,  G06Q10/06311 ,  G06Q10/063116 ,  G06Q10/06312 ,  G06Q10/06398

摘要： A work assignment system for assigning and composing a work formed from a plurality of work standards to a plurality of stations. A display displays the names of the plurality of work standards as composition targets. A composition condition is input. The plurality of work standards are divided in accordance with the composition condition and one group of the divided work standards is assigned to a station. The assignment result of the work standards of each station to a work assignment file is output.

摘要翻译： 一种工作分配系统，用于将从多个工作标准形成的工作分配和组合到多个工位。 显示器将多个工作标准的名称显示为组合目标。 输入组合条件。 多个工作标准根据组成条件划分，一组分工作标准分配给一个工位。 输出每个工作站到工作分配文件的工作标准的分配结果。

公开(公告)号：US20060245050A1

公开(公告)日：2006-11-02

申请号：US11401712

申请日：2006-04-11

申请人： Tomohiro Uchida ,  Makoto Araki ,  Kenji Sasaki

发明人： Tomohiro Uchida ,  Makoto Araki ,  Kenji Sasaki

IPC分类号： G02B21/26

CPC分类号： H01L27/14618 ,  G02B7/00 ,  H01L2924/0002 ,  H04N5/2251 ,  H01L2924/00

摘要： An imaging device includes an imager including an optical receiver, an optical element located on an optical path extending to the optical receiver, a substrate to which the imager is fixed, a casing which covers the imager and the optical element, and a dustproof light-shielding member interposed between the imager and the optical element. The dustproof light-shielding member has an opening which allows light to pass, and a fitting portion formed like a recess in which the imager is to be fitted. The dustproof light-shielding member is held between the imager and the optical element to form a sealed space, protecting a space between the imager and the optical element against dust.

摘要翻译： 一种成像装置包括：成像装置，包括光接收器，位于延伸到光接收器的光路上的光学元件，固定有成像器的基板，覆盖成像器和光学元件的外壳， 插入在成像器和光学元件之间的屏蔽构件。 防尘遮光构件具有允许光通过的开口，以及形成为类似成像装置所在的凹部的嵌合部。 防尘遮光部件保持在成像器和光学元件之间，形成密封空间，保护成像器与光学元件之间的空间免受灰尘侵害。

公开(公告)号：US08665517B2

公开(公告)日：2014-03-04

申请号：US12909938

申请日：2010-10-22

申请人： Makoto Araki

发明人： Makoto Araki

IPC分类号： G02B21/00

CPC分类号： G02B21/24 ,  G02B21/0032 ,  G02B21/004 ,  G02B21/0076 ,  G02B21/361

摘要： Three or more devices can be connected to a microscope and can be used simultaneously. Provided is a microscope connecting unit including a microscope connection port that is connected to a microscope used to observe a sample; three or more unit connection ports to which a stimulating unit that irradiates the sample with light or a confocal observation unit or an image capturing unit that detects light generated at the sample is connectable; and two or more light-path combining units that are disposed between the microscope connecting port and the unit connection ports and that combine light paths optically connecting the microscope with the confocal observation unit, the stimulating unit, and the image capturing unit.

摘要翻译： 可以将三个或更多的装置连接到显微镜并可以同时使用。 提供了一种显微镜连接单元，包括连接到用于观察样品的显微镜的显微镜连接端口; 三个或更多个单元连接端口，其上用光照射样品的刺激单元或共焦焦点观察单元或检测在样品处产生的光的图像捕获单元可连接到该单元连接端口; 以及设置在显微镜连接端口和单元连接端口之间的两个或更多个光路组合单元，并且将光学连接到共聚焦观察单元，刺激单元和图像捕获单元的光路组合。

公开(公告)号：US08620525B2

公开(公告)日：2013-12-31

申请号：US13240066

申请日：2011-09-22

申请人： Makoto Araki ,  Hiroyoshi Kobayashi ,  Tsuyoshi Tsuda ,  Tsubasa Nose

发明人： Makoto Araki ,  Hiroyoshi Kobayashi ,  Tsuyoshi Tsuda ,  Tsubasa Nose

IPC分类号： A01B69/00 ,  B62D6/00 ,  B62D11/00 ,  B62D12/00 ,  B63G8/20 ,  B63H25/04 ,  G05D1/00 ,  G06F7/00 ,  G06F17/00 ,  G06F19/00

CPC分类号： B62K21/00

摘要： A system for performing posture control of a motorcycle is such that in outputting a synthesized output by adjusting a yaw direction output and a roll direction output outputted from a displacement detection sensor by an adjustment part respectively, a synthesized output in which the yaw direction output is larger than the roll direction output is outputted when a vehicle speed is low, and a synthesized output in which the roll direction output is larger than the yaw direction output is outputted when the vehicle speed is high. Accordingly, in either a case where the vehicle is traveling at a low speed or a case where the vehicle is traveling at a high speed, the displacement and the behavior of a motorcycle 10 can be detected with high accuracy thus eventually realizing a control of the posture of the motorcycle 10 with high accuracy.

摘要翻译： 用于执行摩托车的姿势控制的系统使得通过分别通过调节从位移检测传感器输出的偏航方向输出和滚动方向输出来输出合成输出，其中偏转方向输出为 当车速低时输出大于滚动方向输出的情况，并且当车速高时输出滚动方向输出大于偏航方向输出的合成输出。 因此，在车辆以低速行驶的情况下或者车辆高速行驶的情况下，可以高精度地检测摩托车10的位移和行为，从而最终实现对 摩托车10的姿态高精度。

公开(公告)号：US08154796B2

公开(公告)日：2012-04-10

申请号：US11593842

申请日：2006-11-07

申请人： Makoto Araki ,  Hiroshi Sasaki ,  Tatsuo Nakata ,  Makio Ueno

发明人： Makoto Araki ,  Hiroshi Sasaki ,  Tatsuo Nakata ,  Makio Ueno

IPC分类号： G02B21/06

CPC分类号： G02B21/0032 ,  G01N21/6458 ,  G01N2021/6439 ,  G02B21/0044 ,  G02B21/0076 ,  G02B21/0084 ,  G02B21/16 ,  G02B21/32

摘要： A microscope apparatus that can observe into the interior of a specimen and that can apply an optical stimulus over a wide area within a short period of time is provided. The microscope apparatus comprises at least one observation scanning optical system including a laser light source for emitting observation laser light, an objective lens, and a scanning optical system for two-dimensionally scanning the observation laser light in a predetermined examination plane of the specimen via the objective lens; and at least one stimulus optical system which includes a lamp light source for emitting light having a wavelength used for optical stimulation and which irradiates the specimen with the light emitted from the lamp light source.

摘要翻译： 提供了可以观察到样本内部并且可以在短时间内在广泛区域上施加光学刺激的显微镜装置。 显微镜装置包括至少一个观察扫描光学系统，其包括用于发射观察激光的激光光源，物镜和用于在样本的预定检查平面中二维扫描观察激光的扫描光学系统 物镜; 以及至少一个刺激光学系统，其包括用于发射具有用于光学刺激的波长的光的灯光源，并且从灯光源发射的光照射样本。

公开(公告)号：US08035979B2

公开(公告)日：2011-10-11

申请号：US12966251

申请日：2010-12-13

申请人： Yutaka Yoshino ,  Takahiro Shirai ,  Shinji Kadono ,  Mineo Kawamoto ,  Minoru Enomoto ,  Masakatsu Goto ,  Makoto Araki ,  Naoki Toda

发明人： Yutaka Yoshino ,  Takahiro Shirai ,  Shinji Kadono ,  Mineo Kawamoto ,  Minoru Enomoto ,  Masakatsu Goto ,  Makoto Araki ,  Naoki Toda

IPC分类号： H05K1/18

CPC分类号： H01L23/5389 ,  H01L25/105 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/023 ,  H05K1/186 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/10674 ,  Y10T29/49146 ,  H01L2924/00014

摘要： A printed wiring board includes a built-in semiconductor element. A protective film is formed on a semiconductor element-mounted surface of a base substrate to which the built-in semiconductor element is connected to protect the semiconductor element-mounted surface excepting a mounting pad. Upper and side surfaces of the built-in semiconductor element are covered with a first insulating film formed by filling a sealing material. The first insulating film is covered with a second insulating film formed of an insulating resin melted from an insulating layer that is provided in side and upper portions of the built-in semiconductor element.

摘要翻译： 印刷电路板包括内置的半导体元件。 在与内置半导体元件连接的基底基板的半导体元件安装面上形成保护膜，以保护除了安装焊盘之外的半导体元件安装表面。 通过填充密封材料形成的第一绝缘膜覆盖内置半导体元件的上表面和侧表面。 第一绝缘膜被由设置在内置半导体元件的侧部和上部的绝缘层熔化的绝缘树脂形成的第二绝缘膜覆盖。

公开(公告)号：US20090230541A1

公开(公告)日：2009-09-17

申请号：US12395008

申请日：2009-02-27

申请人： Makoto Araki ,  Shimpei Ishida ,  Shigeru Nakamura

发明人： Makoto Araki ,  Shimpei Ishida ,  Shigeru Nakamura

IPC分类号： H01L23/48 ,  H01L21/78 ,  H01L21/50

CPC分类号： H01L24/91 ,  H01L24/24 ,  H01L24/73 ,  H01L24/82 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/92 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0206 ,  H05K1/186 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/10674 ,  H05K2201/10969 ,  H05K2203/049 ,  H01L2224/81 ,  H01L2224/82 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device in which a chip is embedded in a wiring board and bump electrodes formed over the front surface of the semiconductor chip are flip-chip coupled to wiring formed in the wiring board and the entire back surface of the semiconductor chip functions well as a back electrode and a method of manufacturing the semiconductor device. A semiconductor chip is embedded inside a wiring board. The semiconductor chip is flip-chip coupled (face down) to a base substrate as the core layer of the wiring board through bump electrodes. A conductive film is formed over the semiconductor chip's surface reverse to the surface over which bump electrodes are formed. The conductive film functions as a back electrode which supplies a reference voltage to the integrated circuit in the semiconductor chip. The conductive film is electrically coupled to third-layer wiring through vias.

摘要翻译： 其中将芯片嵌入布线板中的半导体器件和形成在半导体芯片的前表面上的凸块电极被倒装芯片耦合到布线板中形成的布线，并且半导体芯片的整个背面的功能很好地作为 背电极和半导体器件的制造方法。 将半导体芯片嵌入在布线板内。 半导体芯片通过凸块电极与布线板的芯层作为基底衬底（面向下）耦合（面向下）。 导电膜形成在与形成凸起电极的表面相反的半导体芯片的表面上。 导电膜用作向半导体芯片中的集成电路提供参考电压的背面电极。 导电膜通过通孔电耦合到第三层布线。

公开(公告)号：US07465609B2

公开(公告)日：2008-12-16

申请号：US11213771

申请日：2005-08-30

申请人： Fumio Murakami ,  Kenichi Imura ,  Makoto Araki

发明人： Fumio Murakami ,  Kenichi Imura ,  Makoto Araki

IPC分类号： H01L21/00 ,  H01L21/46

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In the method of manufacturing a semiconductor device that semiconductor chips are mounted facing-up on the printed wiring board on which a protective insulation film is formed by means of a film-like resist and a plurality of the semiconductor chips are collectively molded by a transfer mold technology, when transfer molding is performed, among the adsorption face of the printed wiring board and the lower die to make adsorb the printed wiring board, the through holes reaching the exterior space of the lower die from the vicinity of the end portion opposing the gate to pour mold resin of a mold cavity are formed as many as possible in order to prevent a short circuit and an open circuit by big deformation of a bonding wire connecting an electrode of the semiconductor chip and an conductor pattern of the printed wiring board.

摘要翻译： 在制造半导体器件的方法中，半导体芯片通过薄膜状抗蚀剂面向上安装在其上形成保护绝缘膜的印刷线路板上，并且多个半导体芯片通过转印共同模制 模具技术，当进行传递成型时，在印刷线路板的吸附面和下模之间，使得吸附印刷电路板，通孔从相对的端部附近到达下模的外部空间 为了防止连接半导体芯片的电极和印刷电路板的导体图案的接合线的大变形，防止短路和开路，模具腔的浇注模塑树脂形成为尽可能多的浇口。

公开(公告)号：US07054826B2

公开(公告)日：2006-05-30

申请号：US09753941

申请日：2001-01-03

申请人： Atsushi Okada ,  Makoto Araki ,  Keiichiro Yokokawa ,  Hirotaka Mizuno ,  Yoshinori Sawamura ,  Tomoyuki Sonekawa

发明人： Atsushi Okada ,  Makoto Araki ,  Keiichiro Yokokawa ,  Hirotaka Mizuno ,  Yoshinori Sawamura ,  Tomoyuki Sonekawa

IPC分类号： G06F17/60

CPC分类号： G06Q10/06 ,  G06Q10/0631 ,  Y10S707/99933 ,  Y10S707/99936

摘要： An information management system includes a work standard creation subsystem, a standard manhour database, a standard manhour setting subsystem, and a work assignment subsystem. The information management system downloads a work standard group with manhour data from the standard manhour setting subsystem and divisionally composes the work standards of the work standard group to a plurality of stations on the basis of a composition condition input by the user into the work assignment subsystem.

摘要翻译： 信息管理系统包括工作标准创建子系统，标准工时数据库，标准工时设置子系统和工作分配子系统。 信息管理系统从标准工时设置子系统下载具有工作标准组的工作标准组，并根据用户输入工作分配子系统的组成条件，将工作标准组的工作标准分为多个工作站 。