Invention Grant
- Patent Title: Electromagnetic bandgap structure and printed circuit board
- Patent Title (中): 电磁带隙结构和印刷电路板
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Application No.: US12010872Application Date: 2008-01-30
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Publication No.: US08035991B2Publication Date: 2011-10-11
- Inventor: Han Kim , Jae-Joon Lee , Mi-Ja Han , Dae-Hyun Park
- Applicant: Han Kim , Jae-Joon Lee , Mi-Ja Han , Dae-Hyun Park
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2007-0010364 20070201; KR10-2007-0093956 20070917
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
Disclosed are an electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit. The electromagnetic bandgap structure in which a first metal layer, a first dielectric layer, a second dielectric layer and a second metal layer are stacked can include a first metal plate, formed between the first dielectric layer and the second dielectric layer; a second metal plate, formed on a same planar surface as the first metal plate, accommodated into a hole which is formed in the first metal plate and electrically connected to the first metal plate through a metal line; and a via, connecting the second metal plate to any one of the first metal layer and the second metal layer. With the present invention, the electromagnetic bandgap structure can be not only miniaturized but also have a low bandgap frequency.
Public/Granted literature
- US20080185179A1 Electromagnetic bandgap structure and printed circuit board Public/Granted day:2008-08-07
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