A printed circuit board, a method of manufacturing the printed circuit board, and an apparatus for perforating via holes are disclosed. By use of a method of manufacturing a printed circuit board that includes forming a first circuit pattern, which includes a reference mark and a via land, on one surface of an insulation substrate; stacking a metal layer on the insulation layer; opening a first window in the metal layer in correspondence with the reference mark; and forming a via which electrically connects the via land with the metal layer, by irradiating light towards the other surface of the insulation substrate and identifying the reference mark through the first window, the occurrence of short-circuiting is prevented in forming vias for electrical interconnection between circuit patterns in a printed circuit board, and as the defect rate caused by eccentricity between insulation layers may be reduced, aspects of the invention may contribute to reducing costs.