公开(公告)号：US08037584B2

公开(公告)日：2011-10-18

申请号：US11979833

申请日：2007-11-08

Applicant: Kwang-Soo Park ,  Sim-Hwan Park ,  Jeong-Yeon Jeong ,  Dae-Jung Byun

Inventor： Kwang-Soo Park ,  Sim-Hwan Park ,  Jeong-Yeon Jeong ,  Dae-Jung Byun

IPC: B23Q1/54 ,  B23Q3/157 ,  B23B39/02

CPC classification number: H05K3/4679 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/0082 ,  H05K3/4652 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/0554 ,  Y10T29/49156

Abstract: A printed circuit board, a method of manufacturing the printed circuit board, and an apparatus for perforating via holes are disclosed. By use of a method of manufacturing a printed circuit board that includes forming a first circuit pattern, which includes a reference mark and a via land, on one surface of an insulation substrate; stacking a metal layer on the insulation layer; opening a first window in the metal layer in correspondence with the reference mark; and forming a via which electrically connects the via land with the metal layer, by irradiating light towards the other surface of the insulation substrate and identifying the reference mark through the first window, the occurrence of short-circuiting is prevented in forming vias for electrical interconnection between circuit patterns in a printed circuit board, and as the defect rate caused by eccentricity between insulation layers may be reduced, aspects of the invention may contribute to reducing costs.

Abstract translation: 公开了一种印刷电路板，印刷电路板的制造方法和穿孔孔的装置。 通过使用包括在绝缘基板的一个表面上形成包括参考标记和通孔接合面的第一电路图案的印刷电路板的制造方法; 在绝缘层上堆叠金属层; 与参考标记相对应地在金属层中打开第一窗口; 以及形成通孔，其通过使所述通孔接地与所述金属层电连接，通过朝向所述绝缘基板的另一表面照射光并通过所述第一窗口识别所述基准标记，在形成用于电互连的通路中防止发生短路 印刷电路板中的电路图案之间以及作为由绝缘层之间的偏心引起的缺陷率可能会降低，本发明的各方面可有助于降低成本。

公开(公告)号：US20080257593A1

公开(公告)日：2008-10-23

申请号：US11979833

申请日：2007-11-08

Applicant: Kwang-Soo Park ,  Sim-Hwan Park ,  Jeong-Yeon Jeong ,  Dae-Jung Byun

Inventor： Kwang-Soo Park ,  Sim-Hwan Park ,  Jeong-Yeon Jeong ,  Dae-Jung Byun

IPC: H05K1/03 ,  B23K26/38 ,  H05K3/06

CPC classification number: H05K3/4679 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/0082 ,  H05K3/4652 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/0554 ,  Y10T29/49156

Abstract: A printed circuit board, a method of manufacturing the printed circuit board, and an apparatus for perforating via holes. By use of a method of manufacturing a printed circuit board that includes forming a first circuit pattern, which includes a reference mark and a via land, on one surface of an insulation substrate; stacking a metal layer on the insulation layer; opening a first window in the metal layer in correspondence with the reference mark; and forming a via which electrically connects the via land with the metal layer, by irradiating light towards the other surface of the insulation substrate and identifying the reference mark through the first window, the occurrence of short-circuiting is prevented in forming vias for electrical interconnection between circuit patterns in a printed circuit board, and as the defect rate caused by eccentricity between insulation layers may be reduced, aspects of the invention may contribute to reducing costs.

Abstract translation: 印刷电路板，印刷电路板的制造方法以及穿孔孔的装置。 通过使用包括在绝缘基板的一个表面上形成包括参考标记和通孔接合面的第一电路图案的印刷电路板的制造方法; 在绝缘层上堆叠金属层; 与参考标记相对应地在金属层中打开第一窗口; 以及形成通孔，其通过使所述通孔接地与所述金属层电连接，通过朝向所述绝缘基板的另一表面照射光并通过所述第一窗口识别所述基准标记，在形成用于电互连的通路中防止发生短路 印刷电路板中的电路图案之间以及作为由绝缘层之间的偏心引起的缺陷率可能会降低，本发明的各方面可有助于降低成本。