Invention Grant
- Patent Title: Optimizing thermal performance using thermal flow analysis
- Patent Title (中): 使用热流分析优化热性能
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Application No.: US11381373Application Date: 2006-05-03
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Publication No.: US08037893B2Publication Date: 2011-10-18
- Inventor: Maximino Aguilar, Jr. , Charles Ray Johns , Mark Richard Nutter , James Michael Stafford
- Applicant: Maximino Aguilar, Jr. , Charles Ray Johns , Mark Richard Nutter , James Michael Stafford
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Yee & Associates, P.C.
- Agent Matthew W. Baca
- Main IPC: E03B1/00
- IPC: E03B1/00 ; F17D1/00 ; F17D3/00 ; G06F1/00

Abstract:
A computer implemented method and system for optimizing thermal performance of a computer system. An identification of a set of processor cores associated with the computer system is made and a thermal index is requested for each of the set of processor cores to form a set of thermal indexes. Proximity information and conductive property information associated with the set of processors is loaded and software is mapped to execute on an optimal processor core form the set of processor cores based the set of thermal indexes, proximity information, and conductive property information.
Public/Granted literature
- US20070260415A1 OPTIMIZING THERMAL PERFORMANCE USING THERMAL FLOW ANALYSIS Public/Granted day:2007-11-08
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