发明授权
- 专利标题： Thermally enhanced wafer level package
- 专利标题（中）： 热增强晶圆级封装
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申请号： US12829017申请日： 2010-07-01
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公开(公告)号： US08039315B2公开(公告)日： 2011-10-18
- 发明人: Hsin-Hui Lee , Mirng-Ji Lii , Chien-Hsiun Lee
- 申请人： Hsin-Hui Lee , Mirng-Ji Lii , Chien-Hsiun Lee
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Haynes and Boone, LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A method of forming a package structure includes providing a plurality of dies; attaching the plurality of dies onto a heat-dissipating plate; and sawing the heat-dissipating plate into a plurality of packages, each including one of the plurality of dies and a piece of the heat-dissipating plate.
公开/授权文献
- US20100273296A1 Thermally Enhanced Wafer Level Package 公开/授权日：2010-10-28
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