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发明授权
US08039365B2 Integrated circuit package system including wafer level spacer 有权
集成电路封装系统，包括晶圆级隔离器

Integrated circuit package system including wafer level spacer
摘要：
An integrated circuit package system that includes providing a wafer level spacer including apertures, which define unit spacers that are interconnected, and configuring the unit spacers to substantially align over devices formed within a substrate.
摘要（中）：

一种集成电路封装系统，其包括提供包括孔的晶片级间隔件，所述孔限定互连的单元间隔件，并且将所述单元间隔件配置为基本上对准在衬底内形成的器件。

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