公开(公告)号：US20120261810A1

公开(公告)日：2012-10-18

申请号：US13536268

申请日：2012-06-28

申请人： Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

发明人： Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

IPC分类号： H01L23/50

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/01067 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit packaging system is provided including: a first device having a first backside and a first active side; and a waferscale spacer having an exact fit at all four corners adjacent to an edge of the first device and a recess along the edge of the first device.

摘要翻译： 提供一种集成电路封装系统，包括：具有第一背面和第一主动侧的第一装置; 以及具有与所述第一装置的边缘相邻的所有四个角处精确配合的晶片间隔件以及沿着所述第一装置的边缘的凹部。

公开(公告)号：US20090057862A1

公开(公告)日：2009-03-05

申请号：US11849127

申请日：2007-08-31

申请人： Jong-Woo Ha ,  BumJoon Hong ,  Sang-Ho Lee ,  Soo-San Park

发明人： Jong-Woo Ha ,  BumJoon Hong ,  Sang-Ho Lee ,  Soo-San Park

IPC分类号： H01L23/538 ,  H01L21/56

CPC分类号： H01L25/03 ,  H01L23/3128 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/06558 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit package-in-package system includes: mounting an integrated circuit device over a package carrier; forming a subassembly including: providing an integrated circuit package system having a carrier interposer with an integrated circuit die thereover, and mounting a device under the carrier interposer; mounting the subassembly over the integrated circuit device; and encapsulating the subassembly and the integrated circuit device over the package carrier.

摘要翻译： 集成电路封装包装系统包括：将集成电路装置安装在封装载体上; 形成子组件，其包括：提供集成电路封装系统，其具有其上具有集成电路管芯的载体插入器，以及将器件安装在所述载体插入器下; 将组件安装在集成电路装置上; 并将该组件和该集成电路器件封装在该封装载体上。

公开(公告)号：US20080012095A1

公开(公告)日：2008-01-17

申请号：US11456845

申请日：2006-07-11

申请人： Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

发明人： Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

IPC分类号： H01L29/06 ,  H01L21/00

CPC分类号： H01L25/0657 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An integrated circuit package system that includes providing a wafer level spacer including apertures, which define unit spacers that are interconnected, and configuring the unit spacers to substantially align over devices formed within a substrate.

摘要翻译： 一种集成电路封装系统，其包括提供包括孔的晶片级间隔件，所述孔限定互连的单元间隔件，并且构造所述单元间隔件以基本上对准在衬底内形成的器件。

公开(公告)号：US20070235846A1

公开(公告)日：2007-10-11

申请号：US11278411

申请日：2006-04-01

申请人： Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

发明人： Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

IPC分类号： H01L23/495

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06593 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit package system that includes forming a strip level net spacer including support bars, tie bars and paddles. Configuring the support bars, the tie bars and the paddles to form open regions and interconnecting the support bars, the tie bars and the paddles to provide structural support to vertically stacked semiconductor devices.

摘要翻译： 一种集成电路封装系统，包括形成包括支撑杆，连接杆和桨叶的带状水平网间隔件。 配置支撑杆，连杆和桨叶以形成开放区域并且互连支撑杆，连杆和桨，以向垂直堆叠的半导体器件提供结构支撑。

公开(公告)号：US20070181998A1

公开(公告)日：2007-08-09

申请号：US11307382

申请日：2006-02-03

申请人： Jong-Woo Ha ,  Sang-Ho Lee ,  Soo-San Park

发明人： Jong-Woo Ha ,  Sang-Ho Lee ,  Soo-San Park

IPC分类号： H01L23/34

CPC分类号： H01L24/48 ,  H01L23/3128 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85399 ,  H01L2224/85986 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/85186 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

摘要： A stacked integrated circuit package system is provided forming a first molded chip comprises attaching a conductor on a wafer, applying an encapsulant around the conductor, and exposing a surface of the conductor in the encapsulant, attaching a first electrical interconnect on the conductor of the first molded chip and stacking an integrated circuit device on the first molded chip with an electrical connector of the integrated circuit device connected to the conductor of the first molded chip with the first electrical interconnect.

摘要翻译： 提供了一种堆叠的集成电路封装系统，其形成第一模制芯片，包括将导体附着在晶片上，在导体周围施加密封剂，以及将导体的表面暴露在密封剂中，将第一电互连件附接到第一 将第一模制芯片上的集成电路器件堆叠在一起，其中集成电路器件的电连接器通过第一电互连连接到第一模制芯片的导体上。

公开(公告)号：US08211749B2

公开(公告)日：2012-07-03

申请号：US11465706

申请日：2006-08-18

申请人： Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

发明人： Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

IPC分类号： H01L21/50

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/01067 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit packaging system is provided including forming a first device wafer having a first backside and a first active side; forming a waferscale spacer wafer having a waferscale spacer and a first opening; mounting the waferscale spacer wafer on the first backside; and singulating an first integrated circuit die having the waferscale spacer from the first device wafer having the first backside with the waferscale spacer wafer thereon.

摘要翻译： 提供一种集成电路封装系统，包括形成具有第一背面和第一有源侧的第一器件晶片; 形成具有晶片间隔件和第一开口的晶片间隔晶片; 将所述晶片间隔晶片安装在所述第一背面上; 以及从具有第一背面的第一器件晶片和其上具有晶片间隔晶片的单片化第一集成电路晶片，其具有晶片尺寸间隔物。

公开(公告)号：US08039365B2

公开(公告)日：2011-10-18

申请号：US11456845

申请日：2006-07-11

申请人： Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

发明人： Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

IPC分类号： H01L21/00 ,  H01L23/02

CPC分类号： H01L25/0657 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An integrated circuit package system that includes providing a wafer level spacer including apertures, which define unit spacers that are interconnected, and configuring the unit spacers to substantially align over devices formed within a substrate.

摘要翻译： 一种集成电路封装系统，其包括提供包括孔的晶片级间隔件，所述孔限定互连的单元间隔件，并且将所述单元间隔件配置为基本上对准在衬底内形成的器件。

公开(公告)号：US20100320621A1

公开(公告)日：2010-12-23

申请号：US12871031

申请日：2010-08-30

申请人： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha

发明人： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha

IPC分类号： H01L23/538 ,  H01L21/60

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing of an integrated circuit package-in-package system includes: mounting a first integrated circuit device over a substrate; mounting an integrated circuit package system having an inner encapsulation over the first integrated circuit device with a first offset; mounting a second integrated circuit device over the first integrated circuit device and adjacent to the integrated circuit package system; connecting the integrated circuit package system and the substrate; and forming a package encapsulation as a cover for the first integrated circuit device, the integrated circuit package system, and the second integrated circuit device.

摘要翻译： 一种用于制造集成电路封装包装系统的方法，包括：将第一集成电路器件安装在衬底上; 在第一集成电路装置上安装具有第一偏移的内封装的集成电路封装系统; 将第二集成电路装置安装在所述第一集成电路装置上并与所述集成电路封装系统相邻; 连接集成电路封装系统和基板; 以及形成作为第一集成电路器件，集成电路封装系统和第二集成电路器件的封装的封装封装。

公开(公告)号：US07829986B2

公开(公告)日：2010-11-09

申请号：US11278411

申请日：2006-04-01

申请人： Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

发明人： Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

IPC分类号： H01L23/495

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06593 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for manufacturing an integrated circuit package system is provided including: forming a strip level net spacer including support bars, tie bars and paddles; configuring the support bars, the tie bars and the paddles to form four or more open regions around each of the paddles; and interconnecting the support bars, the tie bars and the paddles to provide structural support to vertically stacked semiconductor devices formed above first semiconductor devices and directly attached to the paddles.

摘要翻译： 提供了一种用于制造集成电路封装系统的方法，包括：形成包括支撑杆，连接杆和桨叶的带状水平网间隔件; 配置支撑杆，连接杆和桨叶以在每个叶片周围形成四个或更多个开放区域; 并且连接支撑杆，连接杆和桨叶，以向在第一半导体器件上方形成并直接连接到桨叶上的垂直堆叠的半导体器件提供结构支撑。

公开(公告)号：US08093727B2

公开(公告)日：2012-01-10

申请号：US12871031

申请日：2010-08-30

申请人： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha

发明人： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha

IPC分类号： H01L23/538

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing of an integrated circuit package-in-package system includes: mounting a first integrated circuit device over a substrate; mounting an integrated circuit package system having an inner encapsulation over the first integrated circuit device with a first offset; mounting a second integrated circuit device over the first integrated circuit device and adjacent to the integrated circuit package system; connecting the integrated circuit package system and the substrate; and forming a package encapsulation as a cover for the first integrated circuit device, the integrated circuit package system, and the second integrated circuit device.

摘要翻译： 一种用于制造集成电路封装包装系统的方法，包括：将第一集成电路器件安装在衬底上; 在第一集成电路装置上安装具有第一偏移的内封装的集成电路封装系统; 将第二集成电路装置安装在所述第一集成电路装置上并与所述集成电路封装系统相邻; 连接集成电路封装系统和基板; 以及形成作为第一集成电路器件，集成电路封装系统和第二集成电路器件的封装的封装封装。