发明授权
- 专利标题： Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same
- 专利标题（中）： 多层布线基板，使用多层布线基板的半导体装置及其制造方法
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申请号： US11542309申请日： 2006-10-04
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公开(公告)号： US08039756B2公开(公告)日： 2011-10-18
- 发明人: Katsumi Kikuchi , Shintaro Yamamichi , Yoichiro Kurita , Koji Soejima
- 申请人： Katsumi Kikuchi , Shintaro Yamamichi , Yoichiro Kurita , Koji Soejima
- 申请人地址： JP Tokyo JP Kanagawa
- 专利权人： NEC Corporation,Renesas Electronics Corporation
- 当前专利权人： NEC Corporation,Renesas Electronics Corporation
- 当前专利权人地址： JP Tokyo JP Kanagawa
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2005-298159 20051012
- 主分类号： H05K1/16
- IPC分类号： H05K1/16
摘要：
A multilayered wiring board has electrodes disposed on a first surface and a second surface, alternately layered insulation layers and wiring layers, and vias that are disposed in the insulation layer and electrically connect the wiring layers. The second electrode disposed on the second surface is embedded in the insulation layer exposed on said second surface, and the second wiring layer covered by the insulation layer exposed on said second surface does not have a layer for improving adhesion to the insulation layer.
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