Invention Grant
US08039937B2 Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same
有权
形成半导体芯片的方法，如此形成的半导体芯片和具有相同的芯片堆叠封装
- Patent Title: Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same
- Patent Title (中): 形成半导体芯片的方法，如此形成的半导体芯片和具有相同的芯片堆叠封装
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Application No.: US12432003Application Date: 2009-04-29
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Publication No.: US08039937B2Publication Date: 2011-10-18
- Inventor: Hyun-Soo Chung , Seung-Kwan Ryu , Ju-Il Choi , Dong-Ho Lee , Seong-Deok Hwang
- Applicant: Hyun-Soo Chung , Seung-Kwan Ryu , Ju-Il Choi , Dong-Ho Lee , Seong-Deok Hwang
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR2006-63936 20060707
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
Provided are methods of fabricating semiconductor chips, semiconductor chips formed by the methods, and chip-stack packages having the semiconductor chips. One embodiment specifies a method that includes patterning a scribe line region of a semiconductor substrate to form a semiconductor strut spaced apart from edges of a chip region of the semiconductor substrate.
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