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公开(公告)号：US09070852B2
公开(公告)日：2015-06-30
申请号：US13295850
申请日：2011-11-14
Applicant: Sang Hyun Lee , Seong Deok Hwang
Inventor： Sang Hyun Lee , Seong Deok Hwang
CPC classification number: H01L33/22 , H01L33/007 , H01L33/0079 , H01L33/06 , H01L33/24 , H01L33/32 , H01L33/44 , H01L33/48 , H01L33/483 , H01L33/486 , H01L33/50 , H01L33/502 , H01L33/507 , H01L33/56 , H01L33/58 , H01L33/62 , H01L2924/0002 , H01L2933/0066 , H01L2924/00
Abstract: A light emitting device (LED) package and a manufacturing method thereof are provided. The LED package includes an LED including a first electrode pad and a second electrode pad disposed on one surface thereof; a bonding insulating pattern layer configured to expose the first electrode pad and the second electrode pad; a substrate including a via hole bored from a first surface to a second surface and a wiring metal layer formed on an inner surface of the via hole to extend to a part of the second surface; and a bonding metal pattern layer bonded to the wiring metal layer exposed through the via hole at the first surface of the substrate and also bonded to the first electrode pad and the second electrode pad.
Abstract translation: 提供一种发光器件（LED）封装及其制造方法。 LED封装包括LED，其包括设置在其一个表面上的第一电极焊盘和第二电极焊盘; 接合绝缘图案层，被配置为暴露所述第一电极焊盘和所述第二电极焊盘; 包括从第一表面到第二表面钻孔的通孔的基板和形成在通孔的内表面上以延伸到第二表面的一部分的布线金属层; 以及接合金属图案层，其结合到在基板的第一表面处通过通孔暴露的布线金属层，并且还结合到第一电极焊盘和第二电极焊盘。
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公开(公告)号：US08847270B2
公开(公告)日：2014-09-30
申请号：US13327189
申请日：2011-12-15
Applicant: Hun Yong Park , Seong Deok Hwang , Won Ho Jung
Inventor： Hun Yong Park , Seong Deok Hwang , Won Ho Jung
CPC classification number: H01L33/58 , H01L33/486 , H01L33/60 , H01L2224/48091 , Y10S362/80 , H01L2924/00014
Abstract: A light emitting diode (LED) package is provided. The LED package includes an LED, a plurality of lead frames electrically connected with the LED, a package body having a receiving groove exposed to receive the LED therein and including a plurality of supporting units provided to project from an inner side surface of the receiving groove, and a filling member having an engaging groove engaged with the supporting unit at a circumference of a side surface thereof, and included inside the receiving groove.
Abstract translation: 提供了一种发光二极管（LED）封装。 LED封装包括LED，与LED电连接的多个引线框架，封装体，其具有暴露以容纳LED的接收槽，并且包括多个支撑单元，所述支撑单元设置成从接收槽的内侧表面突出 以及填充构件，其具有在其侧表面的圆周处与所述支撑单元接合并且包括在所述接收槽内部的接合槽。
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公开(公告)号：US08587010B2
公开(公告)日：2013-11-19
申请号：US13328864
申请日：2011-12-16
Applicant: Cheol Jun Yoo , Young Hee Song , Seong Deok Hwang , Sang Hyun Lee
Inventor： Cheol Jun Yoo , Young Hee Song , Seong Deok Hwang , Sang Hyun Lee
IPC: H01L33/00
CPC classification number: H01L33/60 , H01L24/97 , H01L33/486 , H01L33/58 , H01L33/62 , H01L33/64 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/01029 , H01L2924/01322 , H01L2924/12041 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00
Abstract: Provided is a light emitting device package including: a plurality of lead frames disposed to be separated from one another; at least one light emitting device mounted on the lead frames and electrically connected to the lead frames through a bonding wire provided on a wire bonding pad, the wire bonding pad being disposed on the same surface as a light emission surface provided as an upper surface of the light emitting device; a body part formed to encapsulate and support the wire bonding pad, the bonding wire, the light emitting device and the lead frames, and having a reflective groove formed in an upper surface thereof to expose the light emission surface to the outside therethrough; and a lens part disposed on the body part, to cover the light emitting device.
Abstract translation: 提供了一种发光器件封装，包括：多个引线框架，被布置成彼此分离; 至少一个发光装置，其安装在引线框架上，并通过设置在引线接合焊盘上的接合线电连接到引线框架，所述引线接合焊盘设置在作为上表面设置的发光面的同一表面上 发光装置; 形成为封装并支撑引线接合焊盘，接合线，发光器件和引线框架的主体部分，并且具有形成在其上表面中的反射槽，以将发光表面暴露于外部; 以及设置在主体部分上的透镜部分，以覆盖发光器件。
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公开(公告)号：US20120205696A1
公开(公告)日：2012-08-16
申请号：US13356245
申请日：2012-01-23
Applicant: Cheol Jun YOO , Young Hee Song , Seong Deok Hwang , Sang Hyun Lee
Inventor： Cheol Jun YOO , Young Hee Song , Seong Deok Hwang , Sang Hyun Lee
CPC classification number: H01L33/642 , H01L24/97 , H01L33/486 , H01L33/647 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/12041 , H01L2924/181 , H01L2933/0033 , H01L2933/0058 , H01L2924/00014 , H01L2924/00
Abstract: There are provided a light emitting device package and a method of manufacturing thereof. The light emitting device package including a first lead frame including amounting area and a heat radiating area surrounding the mounting area, the mounting area being protruded upwardly so as to be located higher than the heat radiating area; a second lead frame disposed to be spaced apart from the first lead frame; at least one light emitting device disposed on the mounting area of the first lead frame; a molding part formed so as to fix the first and second lead frame leads thereto; and a lens part disposed over the at least one light emitting device and the molding part, and the method of manufacturing the light emitting device package are provided.
Abstract translation: 提供了一种发光器件封装及其制造方法。 所述发光器件封装包括包括量区域的第一引线框架和围绕所述安装区域的散热区域，所述安装区域向上突出以被定位成高于所述散热区域; 设置成与所述第一引线框架间隔开的第二引线框架; 至少一个发光器件，设置在第一引线框架的安装区域上; 形成为将第一和第二引线框架引线固定到其上的模制部件; 以及设置在所述至少一个发光器件和所述模制部件上的透镜部分，以及制造所述发光器件封装的方法。
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公开(公告)号：US20120140210A1
公开(公告)日：2012-06-07
申请号：US13298747
申请日：2011-11-17
Applicant: Cheol Jun YOO , Young Hee SONG , Seong Deok HWANG
Inventor： Cheol Jun YOO , Young Hee SONG , Seong Deok HWANG
CPC classification number: G01R31/2635 , G01J1/0422 , G01J2001/4252
Abstract: A tray, a testing apparatus and a testing method using the same are disclosed. The testing apparatus includes a tray having a plurality of light sources received therein, the plurality of light sources outputting light when power is applied thereto; a plurality of optical receiver units arranged to correspond to the plurality of light sources and receiving the light outputted from each of the plurality of light sources; a plurality of probe units arranged to correspond to the plurality of light sources and applying power to each of the plurality of light sources; a power supply control unit selectively controlling power applied to the plurality of probe units; and an optical properties analyzing unit analyzing properties of optical signals from the light received by the optical receiver units.
Abstract translation: 公开了一种托盘，测试装置和使用其的测试方法。 该测试装置包括其中容纳有多个光源的托盘，当向其施加电力时，多个光源输出光; 多个光接收单元，被布置为对应于所述多个光源并接收从所述多个光源中的每一个输出的光; 多个探针单元，其布置成对应于所述多个光源并向所述多个光源中的每一个施加电力; 电源控制单元，选择性地控制施加到所述多个探针单元的电力; 以及光学性质分析单元，分析由光接收单元接收的光的光信号的特性。
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Patent Agency Ranking
公开(公告)号：US20120138988A1
公开(公告)日：2012-06-07
申请号：US13295850
申请日：2011-11-14
Applicant: Sang Hyun LEE , Seong Deok Hwang
Inventor： Sang Hyun LEE , Seong Deok Hwang
CPC classification number: H01L33/22 , H01L33/007 , H01L33/0079 , H01L33/06 , H01L33/24 , H01L33/32 , H01L33/44 , H01L33/48 , H01L33/483 , H01L33/486 , H01L33/50 , H01L33/502 , H01L33/507 , H01L33/56 , H01L33/58 , H01L33/62 , H01L2924/0002 , H01L2933/0066 , H01L2924/00
Abstract: A light emitting device (LED) package and a manufacturing method thereof are provided. The LED package includes an LED including a first electrode pad and a second electrode pad disposed on one surface thereof; a bonding insulating pattern layer configured to expose the first electrode pad and the second electrode pad; a substrate including a via hole bored from a first surface to a second surface and a wiring metal layer formed on an inner surface of the via hole to extend to a part of the second surface; and a bonding metal pattern layer bonded to the wiring metal layer exposed through the via hole at the first surface of the substrate and also bonded to the first electrode pad and the second electrode pad.
Abstract translation: 提供一种发光器件（LED）封装及其制造方法。 LED封装包括LED，其包括设置在其一个表面上的第一电极焊盘和第二电极焊盘; 接合绝缘图案层，被配置为暴露所述第一电极焊盘和所述第二电极焊盘; 包括从第一表面到第二表面钻孔的通孔的基板和形成在通孔的内表面上以延伸到第二表面的一部分的布线金属层; 以及接合金属图案层，其结合到在基板的第一表面处通过通孔暴露的布线金属层，并且还结合到第一电极焊盘和第二电极焊盘。
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公开(公告)号：US20120138974A1
公开(公告)日：2012-06-07
申请号：US13312572
申请日：2011-12-06
Applicant: Cheol Jun YOO , Young Hee Song , Seong Deok Hwang , Sang Hyun Lee
Inventor： Cheol Jun YOO , Young Hee Song , Seong Deok Hwang , Sang Hyun Lee
CPC classification number: H01L33/486 , H01L33/505 , H01L33/58 , H01L33/62 , H01L33/64 , H01L2224/48227 , H01L2924/15321 , H01L2924/1815 , H01L2224/48091 , H01L2924/00014
Abstract: There is provided a light emitting device package including: a substrate having a circuit pattern formed on at least one surface thereof and including an opening; a wavelength conversion layer formed by filling at least a portion of the opening with a wavelength conversion material; and at least one light emitting device disposed on a surface of the wavelength conversion layer and electrically connected to the circuit pattern.
Abstract translation: 提供了一种发光器件封装，包括：具有形成在其至少一个表面上并包括开口的电路图案的衬底; 通过用波长转换材料填充所述开口的至少一部分而形成的波长转换层; 以及设置在所述波长转换层的表面上并电连接到所述电路图案的至少一个发光器件。
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公开(公告)号：US08110922B2
公开(公告)日：2012-02-07
申请号：US12588231
申请日：2009-10-08
Applicant: Hyun-Soo Chung , Seung-Duk Baek , Dong-Ho Lee , Dong-Hyeon Jang , Seong-Deok Hwang
Inventor： Hyun-Soo Chung , Seung-Duk Baek , Dong-Ho Lee , Dong-Hyeon Jang , Seong-Deok Hwang
IPC: H01L23/48
CPC classification number: H01L23/3114 , H01L24/10 , H01L24/13 , H01L25/0655 , H01L25/50 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05548 , H01L2224/05647 , H01L2224/13 , H01L2224/13099 , H01L2224/274 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/3025 , H01L2924/351 , H01L2924/00 , H01L2924/00014
Abstract: A wafer level semiconductor module may include a module board and an IC chip set mounted on the module board. The IC chip set may include a plurality of IC chips having scribe lines areas between the adjacent IC chips. Each IC chip may have a semiconductor substrate having an active surface with a plurality of chip pads and a back surface. A passivation layer may be provided on the active surface of the semiconductor substrate of each IC chip and may having openings through which the chip pads may be exposed. Sealing portions may be formed in scribe line areas.
Abstract translation: 晶片级半导体模块可以包括安装在模块板上的模块板和IC芯片组。 IC芯片组可以包括在相邻IC芯片之间具有划线区域的多个IC芯片。 每个IC芯片可以具有具有多个芯片焊盘和后表面的有源表面的半导体衬底。 可以在每个IC芯片的半导体衬底的有源表面上提供钝化层，并且可以具有可以暴露芯片焊盘的开口。 密封部分可以形成在划线区域中。
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公开(公告)号：US07851256B2
公开(公告)日：2010-12-14
申请号：US12285923
申请日：2008-10-16
Applicant: Hyun-soo Chung , Dong-ho Lee , Seong-deok Hwang , Sun-won Kang , Seung-duk Baek
Inventor： Hyun-soo Chung , Dong-ho Lee , Seong-deok Hwang , Sun-won Kang , Seung-duk Baek
CPC classification number: H01L25/0657 , H01L24/02 , H01L24/16 , H01L25/50 , H01L2224/0401 , H01L2224/05548 , H01L2224/05567 , H01L2224/13023 , H01L2224/13024 , H01L2224/16112 , H01L2224/16147 , H01L2224/16237 , H01L2224/2518 , H01L2224/81141 , H01L2224/81191 , H01L2224/81365 , H01L2224/81385 , H01L2224/81805 , H01L2225/06513 , H01L2225/06527 , H01L2225/06541 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/014
Abstract: Provided is a method of fabricating a chip-on-chip (COC) semiconductor device. The method of fabricating a chip-on-chip (COC) semiconductor device may include preparing a first semiconductor device with a metal wiring having at least one discontinuous spot formed therein, preparing a second semiconductor device with at least one bump formed on a surface of the second semiconductor device corresponding to the at least one discontinuous spot, aligning the first semiconductor device onto the second semiconductor device, and connecting the at least one bump of the second semiconductor device to the at least one discontinuous spot formed in the metal wiring of the first semiconductor device.
Abstract translation: 提供了一种制造片上芯片（COC）半导体器件的方法。 片上芯片（COC）半导体器件的制造方法可以包括：准备具有在其中形成有至少一个不连续点的金属布线的第一半导体器件，制备第二半导体器件，其中至少一个凸点形成在 所述第二半导体器件对应于所述至少一个不连续点，将所述第一半导体器件对准到所述第二半导体器件上，并且将所述第二半导体器件的所述至少一个突起连接到形成在所述第二半导体器件的所述金属布线中的所述至少一个不连续点 第一半导体器件。
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公开(公告)号：US07847416B2
公开(公告)日：2010-12-07
申请号：US12498913
申请日：2009-07-07
Applicant: Hyun-Soo Chung , In-Young Lee , Son-Kwan Hwang , Dong-Ho Lee , Seong-Deok Hwang
Inventor： Hyun-Soo Chung , In-Young Lee , Son-Kwan Hwang , Dong-Ho Lee , Seong-Deok Hwang
CPC classification number: H01L25/50 , H01L21/76898 , H01L25/0657 , H01L29/0657 , H01L2224/0401 , H01L2224/05548 , H01L2224/05567 , H01L2224/0557 , H01L2224/06181 , H01L2224/13025 , H01L2224/94 , H01L2225/06513 , H01L2225/06541 , H01L2225/06555 , H01L2225/06586 , H01L2924/0002 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01093 , H01L2224/11 , H01L2224/05552
Abstract: Wafer level packages and methods of fabricating the same are provided. In one embodiment, one of the methods comprises forming semiconductor chips having a connection pad on a wafer, patterning a bottom surface of the wafer to form a trench under the connection pad, patterning a bottom surface of the trench to form a via hole exposing the bottom surface of the connection pad, and forming a connecting device connected to the connection pad through the via hole. The invention provides a wafer level package having reduced thickness, lower fabrication costs, and increased reliability compared to conventional packages.
Abstract translation: 提供了晶片级封装及其制造方法。 在一个实施例中，方法之一包括形成在晶片上具有连接焊盘的半导体芯片，图案化晶片的底表面以在连接焊盘下方形成沟槽，图案化沟槽的底表面以形成通孔， 并且通过通孔形成连接到连接垫的连接装置。 本发明提供了与传统封装相比，具有减小的厚度，较低的制造成本和增加的可靠性的晶片级封装。
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