发明授权
- 专利标题： Mold lock on heat spreader
- 专利标题（中）： 模具锁上散热器
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申请号： US12463729申请日： 2009-05-11
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公开(公告)号： US08039955B2公开(公告)日： 2011-10-18
- 发明人: Chien-Te Feng , Frank Yu
- 申请人： Chien-Te Feng , Frank Yu
- 申请人地址： US TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： US TX Dallas
- 代理商 Yingsheng Tung; Wade J. Brady, III; Frederick J. Telecky, Jr.
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A mold lock and a method of forming the mold lock are provided. The mold lock is used in an encapsulated semiconductor device and includes a neck and a shaped head integral with the neck. The mold lock can be formed to project above a support component, such as a heat spreader, of the semiconductor device and the neck is formed from the support component. The shaped head is of a greater dimension than the neck and can present a “T” shape in side view or a “Y” shape in side view. A base portion of the neck is seated within the support component. A method is provided for forming the described mold lock.
公开/授权文献
- US20100283142A1 MOLD LOCK ON HEAT SPREADER 公开/授权日：2010-11-11
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