Invention Grant
US08041105B2 Pattern evaluation method, computer-readable medium, and semiconductor device manufacturing method 有权
模式评估方法,计算机可读介质和半导体器件制造方法

Pattern evaluation method, computer-readable medium, and semiconductor device manufacturing method
Abstract:
A pattern evaluation method includes: acquiring a plurality of examination images obtained in regard to an evaluation target pattern, at least one of the plurality of examination images being different from the other examination images; detecting all edges of the evaluation target pattern in each of the examination images; executing alignment of the evaluation target pattern in the respective examination images with a sub-pixel accuracy based on the detected edges; superimposing the aligned pattern edges to generate a single combined edge; measuring the combined edge; and evaluating the evaluation target pattern based on a result of the measurement.
Information query
Patent Agency Ranking
0/0