发明授权
US08041197B2 Heating apparatus, heat treatment apparatus, computer program and storage medium
有权
加热装置，热处理装置，计算机程序和存储介质
- 专利标题： Heating apparatus, heat treatment apparatus, computer program and storage medium
- 专利标题（中）： 加热装置，热处理装置，计算机程序和存储介质
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申请号： US12120637申请日： 2008-05-14
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公开(公告)号： US08041197B2公开(公告)日： 2011-10-18
- 发明人: Shigeru Kasai , Tomohiro Suzuki
- 申请人： Shigeru Kasai , Tomohiro Suzuki
- 申请人地址： JP Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2005-329381 20051114
- 主分类号： F26B19/00
- IPC分类号： F26B19/00
摘要：
A heating apparatus for heating a target object W is provided with a plurality of heating light sources, including LED elements for applying heating light having a wavelength within a range from 360 to 520 nm to the object. Thus, a temperature of only the shallow surface of the object, such as a semiconductor wafer, is increased/reduced at a high speed in uniform temperature distribution, irrespective of the film type.
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