Invention Grant
US08043791B2 Positive photosensitive composition, pattern forming method using the composition and resin for use in the composition
有权
正型感光性组合物，使用组合物中使用的组合物和树脂的图案形成方法
- Patent Title: Positive photosensitive composition, pattern forming method using the composition and resin for use in the composition
- Patent Title (中): 正型感光性组合物，使用组合物中使用的组合物和树脂的图案形成方法
-
Application No.: US12678023Application Date: 2008-09-11
-
Publication No.: US08043791B2Publication Date: 2011-10-25
- Inventor: Yuko Tada , Kazuto Shimada , Shuji Hirano
- Applicant: Yuko Tada , Kazuto Shimada , Shuji Hirano
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2007-239572 20070914; JP2008-201279 20080804
- International Application: PCT/JP2008/066444 WO 20080911
- International Announcement: WO2009/035045 WO 20090319
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/20 ; G03F7/30 ; C08F224/00 ; C07D313/00
Abstract:
A positive photosensitive composition ensuring wide exposure latitude and reduced line edge roughness not only in normal exposure (dry exposure) but also in immersion exposure, a pattern forming method using the positive photosensitive composition, and a novel resin contained in the positive photosensitive composition are provided, which are a positive photosensitive composition comprising (A) a resin having a specific lactone structure in the side chain and being capable of increasing the solubility in an alkali developer by the action of an acid and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, a pattern forming method using the positive photosensitive composition, and a novel resin contained in the positive photosensitive composition.
Public/Granted literature
Information query
IPC分类:
