发明授权
US08044162B2 Adhesion-promoting agent, curable organopolysiloxane composition, and semiconductor device
有权
粘合促进剂,可固化的有机基聚硅氧烷组合物和半导体器件
- 专利标题: Adhesion-promoting agent, curable organopolysiloxane composition, and semiconductor device
- 专利标题(中): 粘合促进剂,可固化的有机基聚硅氧烷组合物和半导体器件
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申请号: US12299929申请日: 2007-05-10
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公开(公告)号: US08044162B2公开(公告)日: 2011-10-25
- 发明人: Yoshitsugu Morita , Tomoko Kato , Hiroshi Ueki , Osamu Tanaka
- 申请人: Yoshitsugu Morita , Tomoko Kato , Hiroshi Ueki , Osamu Tanaka
- 申请人地址: JP Chiyoda-ku, Tokyo
- 专利权人: Dow Corning Toray Company, Ltd.
- 当前专利权人: Dow Corning Toray Company, Ltd.
- 当前专利权人地址: JP Chiyoda-ku, Tokyo
- 代理机构: Howard & Howard Attorneys PLLC
- 优先权: JP2006-133143 20060511; JP2006-182000 20060630
- 国际申请: PCT/JP2007/060092 WO 20070510
- 国际公布: WO2007/132910 WO 20071122
- 主分类号: H01L33/00
- IPC分类号: H01L33/00 ; C08G77/04
摘要:
An adhesion-promoting agent represented by the following average formula: R1aSiO(4-a/2 (where R1 is a group selected from an optionally substituted alkyl group with 1 to 10 carbon atoms, an alkenyl group with 2 to 20 carbon atoms, an aryl group with 6 to 20 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, or an epoxy-containing organic group; however, in one molecule, the content of the alkenyl groups should constitute at least 5 mole % of all groups designated by R1; the content of the aryl groups should constitute at least 5 mole % of all groups designated by R1; the content of the alkoxy groups should constitute at least 5 mole % of all groups designated by R1; the content of the epoxy-containing organic groups should constitute at least 5 mole % of all groups designated by R1; and “a” is a number that satisfies the following condition: 1.0≦a